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Defect detection method and device and computer readable storage medium

A detection method and detection device technology, which is applied in the direction of measurement devices, calculations, and optical testing of defects/defects, can solve the problems of large gray scale differences, large wafer gray scale differences, and unfavorable accurate detection, etc., to reduce errors The effect of the probability of leak detection

Active Publication Date: 2021-05-07
SKYVERSE TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in actual industrial production, due to the difference in production process, the gray level difference between wafers is very large, which will inevitably cause the gray level difference between different reference templates and between the reference template and the wafer to be tested.
Therefore, when testing the wafer to be tested, due to the existence of gray scale differences, some defects will be missed, and some will be judged as qualified parts as defects, which is not conducive to accurate detection

Method used

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  • Defect detection method and device and computer readable storage medium
  • Defect detection method and device and computer readable storage medium
  • Defect detection method and device and computer readable storage medium

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Embodiment Construction

[0047] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0048] In the description of the present invention, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0049] In the description of the present inventio...

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Abstract

The invention discloses a defect detection method and device and a computer readable storage medium. The defect detection method comprises the following steps: 1) acquiring a reference image and an image of a sample to be detected; 2) acquiring a first gray average value of a measuring unit of the image of the sample to be measured; 3) compensating the gray average value of the reference image according to the first gray average value; and 4) comparing the compensated reference image with one measuring unit of the to-be-measured image, and determining the defect of the measuring unit. According to the defect detection method, when the multiple measurement units of the image of the sample to be detected are detected by using the same reference image, gray compensation can be performed on the reference image in real time, the defect with low contrast can be detected under the condition that the detection speed is hardly influenced, and meanwhile, the probability of false detection and missing detection is reduced.

Description

technical field [0001] The invention relates to the technical field of sample defects, in particular to a defect detection method, device and computer-readable storage medium. Background technique [0002] In related technologies, in order to detect defects on the surface of a wafer (such as foreign objects, scratches, etc.), a common solution is to first select a qualified wafer or a part thereof as a reference template. During detection, compare each Die on the Wafer to be detected with the corresponding part in the reference template. If the gray scale difference between the two exceeds the preset threshold after comparison, it is considered a defect. However, in actual industrial production, due to the difference in production process, the gray level difference between wafers is very large, which will inevitably cause the gray level difference between different reference templates and between the reference template and the wafer to be tested. . Therefore, when testing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T7/00G01N21/88
CPCG01N21/8851G01N2021/8887G06T7/0004G06T7/001
Inventor 陈鲁佟异张嵩
Owner SKYVERSE TECH CO LTD