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Method of manufacturing a membrane assembly

A component and diaphragm technology, applied in the field of diaphragm component precursors, can solve problems such as over-etching, surface film damage, lower or upper layer over-etching damage, etc.

Pending Publication Date: 2021-07-30
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Overetching can occur on films with non-uniform layer thicknesses as thinner portions of the layer may be etched before thicker portions of the layer have been etched
This can result in either the underlying or upper layer (depending on which side of the stack is being etched) being damaged by overetching
Over-etching of surface film manufacturing may cause damage to the surface film

Method used

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  • Method of manufacturing a membrane assembly
  • Method of manufacturing a membrane assembly
  • Method of manufacturing a membrane assembly

Examples

Experimental program
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Embodiment Construction

[0066] figure 1 A lithographic system is shown comprising a pellicle 15 (also referred to as a pellicle assembly) manufactured according to the method of the first aspect of the invention. The lithographic system comprises a radiation source SO and a lithographic apparatus LA. The radiation source SO is configured to generate an extreme ultraviolet (EUV) radiation beam B and supply the EUV radiation beam B to the lithographic apparatus LA. The lithographic apparatus LA comprises an illumination system IL, a support structure MT configured to support a patterning device MA (eg a mask), a projection system PS and a substrate table WT configured to support a substrate W.

[0067] The illumination system IL is configured to condition the radiation beam B before it is incident on the patterning device MA. The projection system is configured to project a beam of radiation B (now patterned by mask MA) onto a substrate W. The substrate W may include previously formed patterns. In ...

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Abstract

There is provided a method of manufacturing a membrane assembly for EUV lithography, wherein a layer which forms at least part of a pellicle membrane is provided after one or more etching steps which define a pellicle border holding the pellicle membrane. Also provided is a pellicle substrate, the substrate comprising: a stack having a front face and back face, wherein one or more layers on the back face of the stack have been selectively removed to define a pellicle border region for holding the pellicle membrane before the layer which forms at least part of a pellicle membrane has been provided.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from EP application 18214904.7 filed on December 20, 2018, the entire content of which is incorporated herein by reference. technical field [0003] The present invention relates to methods of making membrane assemblies, and to membrane assembly precursors. The invention has particular, but not exclusive use in conjunction with EUV lithography apparatus and EUV lithography tools. Background technique [0004] A lithographic apparatus is a machine configured to apply a desired pattern to a substrate. A lithographic apparatus may be used in the manufacture of, for example, integrated circuits (ICs). A lithographic apparatus may, for example, project a pattern at a patterning device (eg a mask) onto a layer of radiation-sensitive material (resist) provided on a substrate. [0005] To project a pattern onto a substrate, a lithographic apparatus may use electromagnetic radiation. The wav...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F1/62G03F1/64G03F1/24G03F7/20
CPCG03F1/62G03F1/64G03F7/70983G03F1/24
Inventor 保罗·詹森J·H·W·昆特泽
Owner ASML NETHERLANDS BV