Flexible circuit board processing method and device and apparatus

A flexible circuit board and processing method technology, applied in circuit devices, printed circuit grounding devices, printed circuits, etc., can solve problems such as reducing production costs, improving product yield, and dead conductive glue, so as to reduce production costs and improve Product yield, the effect of reducing the grounding resistance of the steel sheet

Active Publication Date: 2021-08-17
昆山丘钛生物识别科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, for the defective products that fail the test, the main solution is to rework the existing steel sheet grounding resistance defective products, but because the products have been pressed and the conductive adhesive

Method used

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  • Flexible circuit board processing method and device and apparatus
  • Flexible circuit board processing method and device and apparatus
  • Flexible circuit board processing method and device and apparatus

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Embodiment Construction

[0025] The embodiment of this specification provides a flexible circuit board processing method, by applying electricity between the steel sheet surface and the ground wire of the FPC whose steel sheet grounding resistance is unqualified, so that an arc is generated between the conductive particles in the conductive adhesive to destroy the insulating resin layer , so that the resistance value of the conductive adhesive is reduced and good conductivity is obtained, and the grounding resistance of the steel sheet is effectively reduced. When it is reduced to meet the qualified requirements, the defective product can be transformed into a good product and continue to be put into production, which is conducive to reducing the production scrap of FPC Quantity, improve product yield, reduce production costs.

[0026] In order to better understand the technical solutions provided by the embodiments of this specification, the technical solutions of the embodiments of this specification...

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Abstract

The invention discloses a flexible circuit board processing method and device and an apparatus. By adding electricity between the surface of a steel sheet of a target circuit board, namely a flexible circuit board with an unqualified steel sheet grounding resistance value and a ground wire so as to generate electric arcs among the conductive particles in a conductive adhesive to thereby damage an insulating resin layer among the conductive particles, the resistance value of the conductive adhesive is reduced, the good conductivity is obtained, and whether the grounding resistance value of the steel sheet of the target circuit board is qualified or not is detected again after power-on is finished, so that the steel sheet grounding resistance of the target circuit board can be effectively reduced, and products with defective steel sheet grounding resistance values can be converted into good products, the product yield is improved, and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of circuit board testing, in particular to a flexible circuit board processing method, device and equipment. Background technique [0002] Steel sheets play an important role in the grounding structure of a flexible printed circuit (FPC). Due to the rigidity and electrical surface requirements of flexible circuit boards, most flexible circuit boards currently use a combination of steel sheets and conductive adhesives to improve product performance and achieve superior high conductivity and broadband shielding characteristics. One of the more commonly used steel sheet grounding structures is to use conductive adhesive to bond the steel sheet for grounding. For example, a layer of conductive adhesive is pasted between the FPC and the steel sheet, and the grounding performance is achieved through pressing and baking. However, due to problems such as operating parameters and equipment flatness during the lamina...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K1/02
CPCH05K3/00H05K1/0215H05K1/02H05K2203/17H05K2203/162H05K2201/2009H05K2201/0776
Inventor 生长鑫
Owner 昆山丘钛生物识别科技有限公司
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