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Flexible circuit board processing method, device and equipment

A technology for flexible circuit boards and processing methods, which is applied in the direction of circuit devices, printed circuit grounding devices, printed circuits, etc., can solve the problems of reducing production costs, improving product yields, and dead glue of conductive glue, so as to reduce production costs and improve Product yield, the effect of reducing the grounding resistance of steel sheets

Active Publication Date: 2022-07-08
昆山丘钛生物识别科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, for the defective products that fail the test, the main solution is to rework the existing steel sheet grounding resistance defective products, but because the products have been pressed and the conductive adhesive has dead glue, and the parts have been finished The products also need to consider issues such as parts avoidance, and often end up being scrapped, which is not conducive to improving product yield and reducing production costs

Method used

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  • Flexible circuit board processing method, device and equipment
  • Flexible circuit board processing method, device and equipment
  • Flexible circuit board processing method, device and equipment

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Embodiment Construction

[0025] The embodiment of this specification provides a method for processing a flexible circuit board. By applying electricity between the surface of the steel sheet of the FPC with unqualified grounding resistance value of the steel sheet and the ground wire, arcs are generated between the conductive particles in the conductive glue to destroy the insulating resin layer. , so that the resistance value of the conductive adhesive is reduced and good conductivity is obtained, which effectively reduces the grounding resistance of the steel sheet. When it is reduced to meet the qualified requirements, the defective products can be converted into good products and continue to be put into production operations, which is conducive to reducing the production scrap of FPC. quantity, improve product yield and reduce production cost.

[0026] In order to better understand the technical solutions provided by the embodiments of the present specification, the technical solutions of the embod...

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Abstract

The invention discloses a flexible circuit board processing method, device and equipment. By applying electricity between the surface of the steel sheet of the target circuit board, that is, the flexible circuit board with unqualified grounding resistance value of the steel sheet, and the ground wire, the conductive adhesive is internally The arc generated between the conductive particles destroys the insulating resin layer between the conductive particles, so that the resistance value of the conductive adhesive is reduced and good conductivity is obtained. In this way, the grounding resistance of the steel sheet of the target circuit board can be effectively reduced, which is conducive to transforming a product with a poor grounding resistance value of the steel sheet into a good product, thereby improving the product yield and reducing the production cost.

Description

technical field [0001] The invention relates to the technical field of circuit board testing, and in particular, to a flexible circuit board processing method, device and equipment. Background technique [0002] In the flexible printed circuit (Flexible Printed Circuit, FPC) grounding structure, the steel sheet plays an important role. Due to the rigidity and electrical requirements of flexible circuit boards, most flexible circuit boards currently use a combination of steel sheets and conductive adhesives to improve product performance and achieve superior high conductivity and broadband shielding properties. One of the more commonly used steel sheet grounding structures is to use conductive adhesive to bond the steel sheet to the ground. For example, a layer of conductive adhesive is pasted between the FPC and the steel sheet, and the grounding performance is achieved by pressing, baking and curing. However, in the process of lamination and lamination, due to problems suc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K1/02
CPCH05K3/00H05K1/0215H05K1/02H05K2203/17H05K2203/162H05K2201/2009H05K2201/0776
Inventor 生长鑫
Owner 昆山丘钛生物识别科技有限公司
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