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Electrospun cover layer for medical implants

A technology of implants and covering layers, applied in the field of equipment covering medical implants, can solve the problems of valve prosthesis infection, unsatisfactory and other problems

Active Publication Date: 2021-09-07
谢尔蒂斯股份公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This solution is not ideal as durability issues are only mitigated and the materials used can lead to infection of the valve prosthesis

Method used

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  • Electrospun cover layer for medical implants
  • Electrospun cover layer for medical implants
  • Electrospun cover layer for medical implants

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The present invention provides a medical implant having an electrospun cover between a support structure of the inner implant and an electrospun layer, wherein the electrospun cover is for enhanced durability and reduced wear. Specifically, in one embodiment, the present invention provides a heart valve wire structure (support structure, figure 1 ), the electrospun overlay (210, figure 2 ) covering at least a portion of the wire structure and positioned between the heart valve wire structure and the electrospun heart valve or leaflet (310, image 3 )between. For clarity, the electrospun heart valve or leaflets are not shown, and are only shown or indicated at 310 in this example.

[0014] As noted above, the electrospun covering covers at least a portion of the support structure. In the example of a heart valve, the heart valve struts are a typical area of ​​wear. Since the electrospun cover covers the support structure, the electrospun heart valve is no longer in ...

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PUM

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Abstract

A medical implant for enhanced durability and wear reduction is provided that distinguishes a medical implant support structure, an electrospun cover layer covering at least a portion of the medical implant support structure, and an electrospun medical implant layer covering the electrospun cover layer such that the electrospun cover layer is an in-between layer in between the portion of the medical implant support structure and the electrospun medical implant layer. Such implant prevents direct contact for the medical implant support structure with the electrospun medical implant layer and thereby ensures that the electrospun cover layer is in direct contact with the electrospun medical implant layer.

Description

technical field [0001] The present invention relates to devices and methods for covering medical implants to enhance durability and reduce wear. Background technique [0002] The durability of bioprosthetic heart valves can unfortunately be limited due to wear and stress on the valve. An important aspect of maximizing the durability of bioprosthetic heart valves is reducing areas with wear and stress concentrations. [0003] Now, the struts of heart valves are often covered with additional synthetic fabric, usually PTFE or polyester (one or more layers), to reduce wear and tear from direct contact with exposed metal or other hard parts. The synthetic fabric then acts as an anchor for porcine or pericardial tissue attachment. This solution is not ideal as the durability problem is only mitigated and the materials used may lead to infection of the valve prosthesis. [0004] The focus of this invention is to cover medical implants with different techniques to enhance durabil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61L27/16A61L27/34A61L27/50A61L27/56
CPCA61L27/507A61L27/34A61L2420/08A61L2430/20A61L27/16A61L27/56C08L27/18A61L27/58
Inventor S·A·洛佩斯V·范德波特B·贝尔鲁斯M·A·J·考克斯
Owner 谢尔蒂斯股份公司