Electrospun cover layer for medical implants
A technology of implants and covering layers, applied in the field of equipment covering medical implants, can solve the problems of valve prosthesis infection, unsatisfactory and other problems
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[0013] The present invention provides a medical implant having an electrospun cover between a support structure of the inner implant and an electrospun layer, wherein the electrospun cover is for enhanced durability and reduced wear. Specifically, in one embodiment, the present invention provides a heart valve wire structure (support structure, figure 1 ), the electrospun overlay (210, figure 2 ) covering at least a portion of the wire structure and positioned between the heart valve wire structure and the electrospun heart valve or leaflet (310, image 3 )between. For clarity, the electrospun heart valve or leaflets are not shown, and are only shown or indicated at 310 in this example.
[0014] As noted above, the electrospun covering covers at least a portion of the support structure. In the example of a heart valve, the heart valve struts are a typical area of wear. Since the electrospun cover covers the support structure, the electrospun heart valve is no longer in ...
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Abstract
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