A BTO intelligent correction device and method for a fully automatic wire bonding machine

Abstract

The invention relates to a BTO intelligent correction device and method for a fully automatic wire bonding machine. The fully automatic wire bonding machine includes a workbench for carrying chip workpieces, a bonding head with a chopper and an imaging optical system. The BTO intelligent correction device includes: basic marking points, which are set on the workbench and used for imaging optical systems. The system alignment recognition is used as the origin of the plane coordinate system; the detector is set at the theoretical BTO position of the basic mark point on the workbench, and is used to detect the distance between it and the riving knife and induce an electric current when the riving knife moves to an adjacent position above it. Signal; difference correction system, which is used to pre-store the theoretical position coordinates when the hacking knife is sensed, calculate the difference between the actual position coordinates and the theoretical position coordinates when the hacking knife is sensed by the imaging optical system, and obtain the BTO deviation value to make up the difference Correction. The structure is simple and small, without adding additional equipment, and can automatically correct the BTO deviation in real time and improve the bonding accuracy of the chopper.

Description

technical field [0001] The invention relates to the technical field of wire bonding machines, in particular to a BTO intelligent correction device and method for a fully automatic wire bonding machine. Background technique [0002] A fully automatic wire bonding machine is a device that uses ultrasonic waves, heat and pressure to electrically connect metal wires to semiconductor chips and pins. It uses a transducer and a rivet to apply ultrasonic vibrations to the bonding point to form a bond on the chip or pin that is in contact with the wire, thereby achieving a strong electrical connection. By adjusting different process parameters such as pressure, ultrasonic energy and device heating temperature, the required bonding effect can be achieved. The bonding head is installed on the XY motion platform, and the bonding area is determined by the stroke of the XY motion platform. Due to the directional nature of wire bonding, the bond head needs to be rotated to complete the b...

AI Technical Summary

Problems solved by technology

Replacing the riving knife also requires re-measurement

In addition, for fully automatic wire bonding machines, when the hacking knife is rotated to different angles, the BTO will be different due to the machining accuracy and installation accuracy of the parts, which requires frequent recalibration of the BTO and measurement of different BTOs at different angles, manual operation Measurements are heavy and error-prone

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