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A multi-positioning miniled wafer repair welding machine

A technology for multiple positioning and welding machines, applied in welding equipment, manufacturing tools, metal processing, etc., can solve problems such as uneven tin dipping by welding machines, uneven surface, and poor wafer welding quality

Active Publication Date: 2022-06-24
OAEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a multi-positioning welding machine for Mini LED wafer repair, which is used to solve the lack of tin scraping components in most of the current wafer repair welding machines. Flat, making the soldering machine uneven when dipping tin, resulting in uneven tinning in the subsequent spot, and ultimately leading to technical problems of poor wafer soldering quality

Method used

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  • A multi-positioning miniled wafer repair welding machine
  • A multi-positioning miniled wafer repair welding machine
  • A multi-positioning miniled wafer repair welding machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] The embodiment of the present invention provides a welding machine for repairing MiniLED wafers with multiple positioning, such as Figure 1-9 As shown, it includes a base 1, and the base 1 is provided with a welding assembly 2, a clamping assembly 3, a wafer placement rack 7 and a front stage 4, and the front stage 4 is provided with a tin scraping assembly 400, and the tin scraper The assembly 400 includes a tin scraper and a leveling tin block 402 . The tin scraper is disposed above the tin block 402 and is used for leveling the tin block 402 .

[0037] The working principle and beneficial effects of the above technical solutions are as follows: when in use, the PCB board to be repaired is clamped on the clamping assembly 3, and then the welding assembly 2 melts the tin block 402, and then the welding assembly 2 dips the tin block. 402 tin the position to be repaired on the PCB board, and then the soldering component 2 sucks the wafer 600 from the wafer placement rac...

Embodiment 2

[0039] On the basis of the above-mentioned Embodiment 1, the front stage 4 is provided with a tin scraping blade seat 401, and the tin scraping blade seat 401 is rotatably connected with a tin scraping screw shaft 403, and the tin scraping screw shaft 403 is provided with a first rotating The first rotating member is used to drive the tin scraping screw shaft 403 to rotate, the tin scraping blade is fixedly connected to the tin scraping screw shaft 403, and the tin block 402 is installed on the front stage 4 and is located in the Just below the tin scraper.

[0040] The clamping assembly 3 includes a fixed installation plate 301 and a movable installation plate 304. The fixed installation plate 301 is fixed on the base 1, the movable installation plate 304 is slidably connected to the base 1, and a fixed rail 303 is fixedly connected to the fixed installation plate 301. A moving rail 305 is fixedly connected to the moving mounting plate 304;

[0041] A clamping screw 300 is r...

Embodiment 3

[0050] On the basis of Embodiment 1 or 2, the wafer placement table 5 is provided with a wafer feeding mechanism 6, and the wafer feeding mechanism 6 is used for placing the wafer 600 on the crystal taking table 601;

[0051] The wafer feeding mechanism 6 includes a feeding mechanism base 602, a mounting frame 6020 is fixedly connected to the feeding mechanism base 602, and a feeding cylinder 6021 is fixedly connected to the mounting frame 6020. A plurality of wafers 600 are arranged in the body 6021, and a push-out piston rod 6022 is slidably connected to the inside of the feed cylinder 6021. There is a first driving member, and the first driving member is used to drive the push-out piston rod 6022 to slide along the feeding cylinder 6021, and a roller connecting rod 6024 is fixedly connected to the feeding cylinder 6021. A first roller 6025 is rotatably connected to the connecting rod 6024, and a second driving member is arranged on the first roller 6025, and the second driv...

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Abstract

The invention provides a multi-positioning Mini LED wafer repair welding machine, which includes a base, on which a welding assembly, a clamping assembly, a wafer placement frame and a front stage are arranged, and on the front stage A tin scraping assembly is provided, and the tin scraping assembly includes a tin scraper and a flat tin block, and the tin scraper is arranged above the tin block for scraping the tin block. The present invention can solve the problem that most current wafer reinforcement welding machines lack tin scraping components, and the surface of the tin block is uneven after being tinned for many times, which makes the soldering machine uneven when dipping tin, resulting in subsequent tinning Inhomogeneity, which eventually leads to technical problems of poor wafer bonding quality.

Description

technical field [0001] The invention relates to the technical field of wafer repairing equipment, in particular to a welding machine for repairing Mini LED wafers with multiple positioning. Background technique [0002] Wafer repair welding machine is used in semiconductor Mini LED wafer direct display screen and backlight screen. After the wafer lamp beads are missing, it is directly repaired and welded at the designated position, so that the screen can be used normally. At present, most of the wafer repair equipment The solid soldering machine lacks tin scraping components, and the surface of the tin block is uneven after many times of tin removal, which makes the soldering machine uneven when dipping the tin, resulting in uneven tin at the subsequent points, which ultimately leads to poor wafer welding quality. SUMMARY OF THE INVENTION [0003] The invention provides a multi-positioning Mini LED wafer repair welding machine, which is used to solve the problem that most ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P6/00B23K3/00B23K3/08
CPCB23K3/00B23K3/08
Inventor 王庆富
Owner OAEM TECH