Unlock instant, AI-driven research and patent intelligence for your innovation.

Multi-positioning welding machine for repairing and fixing Mini LED wafer

A technology of multiple positioning and welding machines, used in welding equipment, auxiliary devices, metal processing, etc., can solve the problems of poor wafer welding quality, lack of tin scraping components, uneven surface, etc.

Active Publication Date: 2022-03-15
OAEM TECH
View PDF7 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a multi-positioning welding machine for Mini LED wafer repair, which is used to solve the lack of tin scraping components in most of the current wafer repair welding machines. Flat, making the soldering machine uneven when dipping tin, resulting in uneven tinning in the subsequent spot, and ultimately leading to technical problems of poor wafer soldering quality

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-positioning welding machine for repairing and fixing Mini LED wafer
  • Multi-positioning welding machine for repairing and fixing Mini LED wafer
  • Multi-positioning welding machine for repairing and fixing Mini LED wafer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] The embodiment of the present invention provides a welding machine for repairing and fixing Mini LED wafers with multiple positioning, such as Figure 1-9 As shown, a base 1 is included, and the base 1 is provided with a welding assembly 2, a clamping assembly 3, a wafer placement frame 7 and a front stage 4, and the front stage 4 is provided with a tin scraping assembly 400, and the tin scraping assembly 400 is arranged on the front stage 4. The assembly 400 includes a tin scraper and a flat tin block 402 , the tin scraper is disposed above the tin block 402 and used for scraping the tin block 402 .

[0037] The working principle and beneficial effects of the above technical solution are as follows: when in use, the PCB board to be repaired is clamped on the clamping component 3, and then the soldering component 2 melts the tin block 402, and then the soldering component 2 dips the tin block 402 Fill tin on the position to be repaired on the PCB, and then the welding c...

Embodiment 2

[0039] On the basis of the above-mentioned embodiment 1, a tin scraper seat 401 is provided on the front stage 4, and a tin scraper screw shaft 403 is rotatably connected to the tin scraper seat 401, and the tin scraper screw shaft 403 is provided with a first rotating The first rotating part is used to drive the tin scraping screw shaft 403 to rotate, the tin scraping knife is fixedly connected to the tin scraping screw shaft 403, the tin block 402 is installed on the front stage 4, and is located at The tin scraper is directly below.

[0040] The clamping assembly 3 includes a fixed mounting plate 301 and a movable mounting plate 304, the fixed mounting plate 301 is fixed on the base 1, the mobile mounting plate 304 is slidably connected to the base 1, and the fixed mounting plate 301 is fixedly connected with a fixed rail 303, A mobile rail 305 is fixedly connected to the mobile mounting plate 304;

[0041] The fixed mounting plate 301 is rotatably connected with a clampin...

Embodiment 3

[0050] On the basis of Embodiment 1 or 2, the wafer placing table 5 is provided with a wafer giving mechanism 6, and the wafer giving mechanism 6 is used to place the wafer 600 on the wafer taking table 601;

[0051] The wafer giving mechanism 6 includes a giving mechanism base 602, a mounting frame 6020 is fixedly connected to the giving mechanism base 602, a giving cylinder 6021 is fixedly connected to the mounting frame 6020, the giving cylinder A plurality of wafers 600 are arranged in the body 6021, and a push-out piston rod 6022 is slidably connected in the giving cylinder body 6021, and a first elastic member 6023 is set on the push-out piston rod 6022, and a first elastic member 6023 is set on the push-out piston rod 6022. There is a first driving part, and the first driving part is used to drive the push-out piston rod 6022 to slide along the giving cylinder 6021, and a roller connecting rod 6024 is fixedly connected to the giving cylinder 6021, and the roller The con...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a multi-positioning Mini LED wafer repair welding machine, which comprises a base, the base is provided with a welding assembly, a clamping assembly, a wafer placing rack and a front table, the front table is provided with a tin scraping assembly, the tin scraping assembly comprises a tin scraping knife and a tin scraping block, and the tin scraping knife is arranged above a tin block and is used for scraping the tin block. The tin scraping assembly can solve the technical problems that at present, most of wafer repairing and fixing welding machines are lack of tin scraping assemblies, the surfaces of tin blocks are uneven after tin is taken for multiple times, the welding machines are uneven in tin dipping, follow-up tin dispensing is uneven, and finally the wafer welding quality is poor.

Description

technical field [0001] The invention relates to the technical field of wafer repair equipment, in particular to a multi-positioning Mini LED wafer repair welding machine. Background technique [0002] Wafer repair welding machine is used in semiconductor Mini LED wafer direct display screen and backlight screen. After the lack of wafer lamp beads, it is directly repaired at the designated position and then welded to make the screen work normally. At present, most of the wafer repair equipment The solid soldering machine lacks tin scraping components, and the surface of the tin block is uneven after being tinned for many times, making the soldering machine uneven when dipping tin, resulting in uneven tinning in the subsequent spots, and ultimately resulting in poor wafer soldering quality. Contents of the invention [0003] The invention provides a multi-positioning welding machine for Mini LED wafer repair, which is used to solve the lack of tin scraping components in most...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/00B23K3/08
CPCB23K3/00B23K3/08
Inventor 王庆富
Owner OAEM TECH