Pressing device and display device
A pressing device and display device technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as poor pressing and affecting the reliability of display substrates
Pending Publication Date: 2022-04-08
BAZHOU YUNGU ELECTRONICS TECH CO LTD
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Problems solved by technology
[0003] The display substrate of the display device needs to be connected to an external control device such as a driver chip through a lamination process. However, in the current lamination process, limited to the structural design of the lamination equipment, poor lamination is prone to occur, thereby affecting the reliability of the display substrate.
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[0025] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some, not all, embodiments of the application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.
[0026] Such as figure 1 As shown, the display device 100 includes an array substrate 110 , an adhesive film 120 and a flip-chip packaging structure 130 . The array substrate 110 includes a binding area 1 . The flip-chip package structure 130 is located on a side of the adhesive film 120 away from the array substrate 110 .
[0027] It should be noted that the display device 100 may include a display panel, the display panel includes an opposing display substrate and a cover plate 140, the displa...
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The invention provides a pressing device and a display device. The pressing device comprises a pressing head part and a supporting part. And the pressure head part is configured to apply pressure to one side, deviating from the adhesive film, of the flip chip packaging structure. The supporting component is opposite to the pressure head component and comprises a main body part and a protruding part, the protruding part and the main body part are arranged in a coplanar mode, and the protruding part is arranged on one side of the main body part in a protruding mode. The main body part is configured to apply pressure to the side, away from the adhesive film, of the array substrate. The protruding portion is configured to apply pressure to one side of the extension portion away from the flip chip package structure. According to the pressing device, the supporting part is arranged to be the main body part and the protruding part, the protruding part is used for applying pressure to the side, deviating from the flip chip packaging structure, of the extending part of the adhesive film, so that the protruding part can support the adhesive film exceeding the binding area of the array substrate, and the adhesive film exceeding the binding area of the array substrate is prevented from being in a suspended state.
Description
technical field [0001] The present application relates to the field of display technology, in particular to a pressing device and a display device. Background technique [0002] At present, the narrow bezels of display devices such as TVs, mobile phones or watches are popular among people due to their high screen-to-body ratio and compact appearance. Therefore, the bezels of display devices are getting narrower and narrower has become a development trend. [0003] The display substrate of the display device needs to be connected with an external control device such as a driver chip through a lamination process. However, in the current lamination process, limited to the structural design of the lamination equipment, poor lamination is prone to occur, thereby affecting the reliability of the display substrate. Contents of the invention [0004] The present application provides a lamination device and a display device. The lamination device is configured by setting the suppor...
Claims
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IPC IPC(8): H01L21/67H01L33/48
Inventor 刘强崔雪蕊
Owner BAZHOU YUNGU ELECTRONICS TECH CO LTD