Display device and preparation method thereof

Abstract

The invention discloses a display device and a preparation method thereof, and belongs to the technical field of semiconductor devices.The preparation method of the display device comprises the steps that wavelength conversion layers are provided, and the wavelength conversion layers comprise the first wavelength conversion layer and the second wavelength conversion layer which are provided respectively; the thickness of the second wavelength conversion layer is greater than that of the first wavelength conversion layer; the first wavelength conversion layer is firstly transferred to a pixel point through the substrate, and then the second wavelength conversion layer is transferred to other pixel points through the substrate; according to the invention, the wavelength conversion layer and the wavelength conversion layer transferred according to the thickness sequence are respectively provided, so that the preparation of the display device for transferring the wavelength conversion layer according to the sequence is realized. The display device provided by the invention comprises at least two wavelength conversion layers with different thicknesses, so that no gap exists between the wavelength conversion layers and the pixel points, and the combination is tighter.

Description

technical field [0001] The invention belongs to the technical field of semiconductor devices, in particular to a display device and a preparation method thereof. Background technique [0002] Micro-display (Micro-LED, micro light-emitting diode) is realized by LED miniaturization and matrixing. Compared with traditional LED display, Micro-LED is different in die, packaging, integration process, backplane, driver and other processes. [0003] Micro-LED, also known as micro light-emitting diode, refers to a high-density integrated LED array. The distance between the LED pixels in the array is in the order of 0.1-100 microns, and each LED pixel can emit light by itself. Since a higher number of integrations can be obtained on a chip of the same area, the integration density of Micro-LED microdisplays is greatly improved, thereby increasing the display resolution, while ensuring high brightness, and can achieve low energy consumption or high brightness display design. [0004] ...

AI Technical Summary

Problems solved by technology

The color conversion layer can be integrated into the display substrate by means of transfer, but it involves the transfer of conversion layers of multiple colors. The traditional one-time overall transfer method has a low yield rate. At the same time, the thickness of different color conversion layers is not uniform, which will lead to One or several color conversion layers are not tightly bonded to the display substrate, causing light leakage and reducing conversion efficiency, resulting in poor display effect

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