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A kind of uniform temperature plate filling system and control method

A technology of temperature chamber and controller, applied in lighting and heating equipment, indirect heat exchangers, etc., can solve the problem of low accuracy of the target charging amount of liquid working medium in the chamber, affecting the performance and life of the chamber. , It is difficult to charge the uniform temperature plate products in batches, so as to achieve the effect of simple structure, good temperature uniformity performance and long service life.

Active Publication Date: 2022-08-02
XINXIANG TEMEITE HEAT TRASFER EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Problems such as waste heat and temperature control generated during the operation of electronic equipment need to be solved more effectively, and the characteristics of high thermal conductivity and good temperature uniformity of the vapor chamber have become a very effective solution to the problem of high heat flux electronic heat dissipation. As one of the means, the existing vapor chamber filling technology mainly uses a combination of vacuum pumps and molecular pumps to evacuate the product to below 0.01Pa, and then rely on the vacuum pressure difference to fill the working medium into the vapor chamber product. At the same time, the existing vapor chamber charging needs to be manually operated to control the filling amount of the liquid working medium in the vapor chamber, while heating the phase change working medium from liquid working medium to gaseous working medium and discharged to the atmosphere, and then weighed It is important to observe whether the target charging amount is reached, but the molecular pump in the device is very expensive and economical; it is difficult to fill the chamber of the chamber with liquid working medium only by relying on the pressure difference formed by the degree of vacuum, and the chamber of the chamber will be A lot of non-condensable gas remains, which affects the uniform temperature performance and life of the vapor chamber; the labor cost is high, the charging efficiency is low, and the accuracy of the target charge amount of the liquid working medium in the vapor chamber is low. The space is very large, and it is difficult for vacuum pumps and molecular pumps to pump the entire system to the required vacuum degree, so it is difficult to realize batch filling of vapor chamber products and other issues

Method used

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  • A kind of uniform temperature plate filling system and control method
  • A kind of uniform temperature plate filling system and control method

Examples

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Effect test

Embodiment 1

[0024] see figure 1 , the present invention provides a technical solution: a uniform temperature plate filling system, including a working medium storage tank 7, a booster pump 11, a vacuum pump 14, a liquid storage tank 18, a dynamic weighing device 25 and a controller 26, the said The top of the working medium storage tank 7 is provided with a filling pipe, and the filling pipe is provided with a filling solenoid valve 1, and the top of the working medium storage tank 7 is connected with a venting pipe, and the venting pipe is provided with a venting pipe. Solenoid valve 2, the working medium storage tank 7 is connected with a pressure sensor 3 and a temperature sensor 4, the side wall of the working medium storage tank 7 is provided with a first photoelectric liquid level gauge 5 and a first heater 6; a booster pump 11 The inlet end and the outlet end are respectively connected with the first three-way joint 10 and the second three-way joint 13 through the connecting pipe, ...

Embodiment 2

[0031] see Figure 1-2 , the present invention also provides a technical solution: a method for filling a temperature chamber, comprising the above-mentioned filling system for a chamber, including the following steps:

[0032] S1, open the air release solenoid valve 2 and the filling solenoid valve 1, close the first solenoid valve 8, the second solenoid valve 9, the third solenoid valve 12, and the fourth solenoid valve 15, and then fill the working fluid storage tank 7 Phase change working medium, when the first photoelectric liquid level meter 5 detects the liquid level of the working medium and transmits a signal to the controller 26, the controller 26 sends an instruction after receiving the signal from the first photoelectric liquid level gauge 5 to close the filling solenoid valve 1 and bleed solenoid valve 2;

[0033] S2, install the temperature equalizing plate 23, the controller 26 controls to start the dynamic weighing device 25 to record the initial weight of the...

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Abstract

The invention discloses a uniform temperature plate filling system and a control method, comprising a working medium storage tank, the top of the working medium storage tank is provided with a filling pipe, and the side wall of the working medium storage tank is provided with a heater; The upper and lower ends of the side wall of the mass storage tank are connected with the booster pump through connecting pipes and tee joints, and the outlet end of the booster pump is connected with the vacuum pump through the tee joints and connecting pipes, and the weighing surface of the dynamic weighing device is equipped with The second heater, the top and bottom ends of the liquid storage tank are connected with connecting pipes; the weighing surface of the dynamic weighing device is provided with a temperature equalizing plate, and the inlet and outlet of the filling cavity in the equalizing plate are respectively connected with charging The injection pipe and the exhaust pipe; the temperature equalizing plates are connected end-to-end through the serial conveying pipe; the outer side of the temperature equalizing plate is respectively provided with an automatic sealing device and an automatic cutting and sealing device at the positions corresponding to the filling pipe and the exhaust pipe. The invention has the advantages of good economical type, good temperature uniformity performance of the uniform temperature plate, long service life and high filling efficiency.

Description

technical field [0001] The invention relates to the technical field of filling of the temperature chamber, in particular to a system and a control method of a temperature chamber. Background technique [0002] With the rapid development of microelectronics technology, the feature size of electronic devices continues to decrease, and the integration degree, packaging density and operating frequency of chips continue to increase, which all lead to a rapid increase in the heat flux density of the chip. Problems such as waste heat and temperature control generated during the operation of electronic equipment need to be solved more effectively, and the high thermal conductivity and good temperature uniformity of the vapor chamber are very effective in solving the problem of high heat flux density. One of the means, the existing vapor chamber filling technology is mainly to use a combination of vacuum pump, molecular pump, etc., to vacuum the product to below 0.01Pa, and then rely...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D15/02
CPCF28D15/0283
Inventor 张瑞青振江单丽丽
Owner XINXIANG TEMEITE HEAT TRASFER EQUIP CO LTD
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