Connector apparatus for microelectronic apparatus and its probe device

A technology of microelectronic devices and test heads, applied in the field of probes, to achieve reliable electrical contact, reliable testing and enhanced test functions, and reduced size

Inactive Publication Date: 2004-05-05
菲康姆株式会社
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] The methods listed above and others have been unsuccessful in providing high performance probes that enable economical hardening and rapid testing of microelectronic devices on wafers before the wafers are diced into discrete chips

Method used

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  • Connector apparatus for microelectronic apparatus and its probe device
  • Connector apparatus for microelectronic apparatus and its probe device
  • Connector apparatus for microelectronic apparatus and its probe device

Examples

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Embodiment Construction

[0065] In accordance with the principles of the present invention, a first preferred embodiment of an adaptable probe is shown in Figure 5 . The disclosed probes allow reliable electrical connections to be made on contact pads of microelectronic devices such as integrated circuits (ICs), flip-bond chips, passive devices, and chip-scale packages. The probe provides elastic vertical movement of the probe tip 81 in response to a force on the tip. Thus, when the contact pad is urged into contact with the probe tip 81, the mechanical bending of the structure allows the tip to come into contact with the mating contact pad with a force sufficient to cause the probe tip 81 to penetrate the pad on the pad. insulating oxide film. The mechanical flexing of the probes accommodates the height variation of the contact pads in the microelectronic device area, while providing sufficient force on each probe tip to ensure a reliable electrical connection between the tip 81 and the correspond...

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Abstract

A mechanically compliant connector for making reliable electrical connections to contact pads on microelectronic devices. The connector can be used for burn-in of integrated circuits at the wafer level. Additional applications incldue probe cards for testing integrated circuits and sockets for flip-chips. One configuration of the connector includes a probes, each of which has a tip projecting above a thin elongated spring. The spring is supported above a substrate by posts such that the probe tip is free to move vertically in response to a contact force on the probe tip. Deflection of the probe tip is compliantly limited by bending and stretching of the thin spring. Mechanical compliance of the tip allows arrays of the probe to contact pads on integrated circuits where the pads are not precisely planar.

Description

[0001] Cross References to Related Applications [0002] This application utilizes the co-pending application entitled "Adaptable Probe Device". technical field [0003] This invention relates to burn-in and inspection of microelectronic devices, and in particular to probes for use in socket assemblies adapted to form connections to integrated circuits within a single chip or wafer form. Background technique [0004] During production, microelectronic devices are subjected to a series of testing procedures to verify functionality and reliability. The testing process typically includes wafer probe testing, in which microelectronic device chips are tested before they are diced from the wafer and packaged to determine the operation of each chip. Probe cards made of long cantilever wires are used to test one or several chips at the wafer level. [0005] Typically, during wafer probe testing, not all of the chips...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H01L21/66G01R1/04G01R1/067G01R1/073G01R31/26
CPCG01R1/0466G01R1/0483G01R1/06727G01R1/06738G01R1/07314H01L22/00
Inventor托马斯·H·迪斯蒂法诺
Owner菲康姆株式会社