Contact switch and appts. provided with contact switch

Abstract

To enable to reduce the film thickness variations at the contact point part by simple structural changes, and by reducing variations of gap amount between the contact points, stabilize actions at the time of closing of the contact points, and reduce propagation loss of a signal by improving the high frequency property. At a stationary substrate 1, a plurality of fixed contact points 4a, 5a and signal wires 4, 5 are arranged and installed. At a movable substrate 10 which counters the stationary substrate 1, the movable contact point 18 closed and separated from the fixed contact points 4a, 5a is installed. The film thickness of the fixed contact points 4a, 5a are made to be smaller than the film thickness of the signal wires 4, 5, and at the closing of the fixed contact points 4a, 5a and the movable point 18, the movable point 18 is made to enter into a recess part constituted of the fixed contact points 4a, 5a, and conduction of the signal wires 4, 5 is carried out linearly.

Description

technical field [0001] The invention relates to a contact switch and a device with the contact switch, in particular to a contact switch and a device with the contact switch which are suitable for use in micro relays used as switching elements for high-frequency signals. Background technique [0002] Conventionally, an electrostatic microrelay described in Patent Document 1 as one form of a contact switch is known. Figure 8A , Figure 8B An electrostatic microrelay according to this prior art is shown. in addition, Figure 8A A perspective view representing an electrostatic miniature relay, Figure 8B Shows a cross-sectional view along line b-b. [0003] Such as Figure 8A As shown, the electrostatic microrelay is mainly composed of a fixed substrate 201 formed of a glass substrate and an insulating substrate, and a movable substrate 202 formed of a semiconductor such as silicon (Si). [0004] On one fixed substrate 201, a fixed electrode 204 covered with an insulating f...

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Problems solved by technology

[0027] When the fixed electrode 204 is not in contact with the movable electrode 208, since the amount of elastic deformation of the second elastic support part 212 is reduced, if the above-mentioned spring design is used, the second elastic support part 212 cannot be used to move the movable electrode 212 sufficiently. Contact 209 is pressed on fixed contact 206, in this case, also can produce the problem that can not ensure the contact reliability between contacts

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