62results about How to "Guaranteed contact reliability" patented technology

The present application relates to the technical field of connector, especially to an electric connector assembly. The electric connector assembly comprises a shell, a PCB adapter plate is arranged in the shell, two or more rows of non-ground cables are electrically and fixedly connected to the PCB adapter plate, two or more rows of connecting pads are arranged on the front and back surfaces of the PCB adapter plate respectively, each row of connecting pads comprises a row of signal pads and ground pads, the core wire of the non-ground cable is electrically and fixedly connected to the signal pad on the front surface, the conductive outer sheath is electrically connected to the ground pad on the front surface, the signal pad and the ground pad on the back surface are used for being electrically connected to the corresponding terminals of a PCB female plate or being electrically connected to the corresponding terminals of an adapter socket and then being electrically connected to the PCB female plate, the PCB adapter plate is internally arranged with a conductive circuit to correspondingly connect the connecting pads on the front and back surfaces of the PCB adapter plate, and the electric connector assembly further comprises a load bottom support which is locked and connected to the shell. The electric connector assembly can realize multi-row high-density wiring and greatly improve the performance of the connector.

The invention discloses a directional array feeding device for assembling relay assemblies. The device comprises a feeding base, a microcosmic array interface arranged on the feeding base and a posture locking transmission module. The microcosmic array interface comprises discrete guide units which are arranged in a matrix mode, non-continuous point-shaped contact is established between the microcosmic array interface and a to-be-assembled electronic element, and under plane reciprocating mechanical excitation, the non-assembling face (generally a plane) of the element is stably supported on the discrete guide units by means of the gravity center offset characteristic of the element. All elements are unified to a middle stable posture with an assembly surface (generally a convex surface) facing upwards. And then, through locking and overall overturning of the posture locking transmission module, the feeding posture with the non-assembly face exposed upwards is output. The off-line feeding jig can efficiently provide contact materials which are uniform in direction and suitable for being sucked by a vacuum suction nozzle for a relay automatic assembly production line, and the problems that micro contacts are difficult to feed and prone to adhesion, and the surfaces of the micro contacts are prone to being scratched are solved.

The invention relates to the technical field of photoelectric devices, and discloses an optical engine packaging structure and a preparation method thereof. The structure comprises an adapter plate structure, an electrical module, a first rewiring layer, an optical module and a packaging substrate, a containing space of the adapter plate structure comprises at least part of the thickness of the adapter plate structure, and a conductive structure is arranged in a penetrating mode in the thickness direction; the electrical module is arranged in the accommodating space and the front surface of the electrical module is exposed; the first redistribution layer is arranged on the adapter plate structure and is electrically communicated with the conductive structure and the electrical module; the optical module is arranged on the first rewiring layer, the front side faces the first rewiring layer, and an optical port is exposed to the external space and connected with an external optical device; the packaging substrate is arranged on the back surface of the adapter plate structure and is suitable for being electrically connected with the electrical module. According to the invention, the optical module is stacked on the electrical module, so that the warping is reduced, the signal transmission is improved, the packaging size is reduced, and the process is simple.