299results about How to "Reliable grounding" patented technology

The invention provides a weld method compounding an ultrasonic and a gas metal arc welding so as to make use of the cavitation effect and the vibration effect of the ultrasonic to lead welding drops generated by the gas metal arc welding to be smoothly transmitted to a welding pool when the drops are still small. And when in welding, an electric arc shrinks under the effect of the ultrasonic and then the stiffness of the electric arc can be enhanced, which has a significant application value for welding of special positions such as a full-position welding, an overhead position welding, a flat position welding and a horizontal position welding, etc.. The invention includes the following steps: an ultrasonic generator is connected with an ultrasonic transducer 2 to convert ultrasonic energy into mechanical vibration; an ultrasonic transformer 3 enlarges amplitude; a conductive tip 5 is combined with the ultrasonic transformer; a protective gas nozzle 4 is fixed on the vibration node of the transformer; a welding wire 1 is connected with the conductive tip 5 to start a welding power supply 9 and then start an ultrasonic power supply after the electric arc becomes stable, then the transducer converts electrical energy into vibration and the ultrasonic transformer enlarges the ultrasonic amplitude which is transmitted to a melting electrode.

The invention discloses a welding method of compounding ultrasonic and nonconsumable electrode voltaic arc. Under the welding condition of protection of nonconsumable electrode gas, the ultrasonic is conducted into welding arc through the conductive electrode and the voltaic arc obviously contracts after ultrasound is carried on. The invention not only has the advantages of stable welding process and high welding and forming quality which normal TIG welding has, but also can improve weld penetration of single-pass welding and therefore the method can realize high quality welding under normal welding condition. The invention converts the high frequency electrical signals of ultrasound supply into mechanical vibration through an energy conversion device and the mechanical vibration is amplified by an amplitude transformer, and then is transmitted to an electrode studded in the amplitude transformer so as to generate supersonic vibration of corresponding frequency on the electrode. The input power of the ultrasound can be adjusted at will between 1W to 1000W and then welding is carried out by the method of normal gas metal arc welding. When voltaic arc is applied to processing pieces, the energy is concentrated, thereby effectively improving utilization ratio of voltaic arc during welding.

Embodiments of the invention disclose a method for processing a groove on a printed circuit board, the printed circuit board and an electronic device. The method for processing the groove on the printed circuit board comprises: processing the groove, the dimension of which is matched with that of a heat-dissipating metal base on a first board set; fixedly arranging the heat-dissipating metal base in the groove processed in the first board set; stitching a second board set with the first board set and thus a third board set is formed; providing a groove in the surface of the second board set after stitching so as to form a blind groove for installing components, wherein partial or all bottom surface of the blind groove is arranged on the heat-dissipating metal base and at least one surface of the heat-dissipating metal base is exposed; and the depth of the blind groove in the vertical direction on the surface of the third board set is larger than the thickness of the second board set after stitching. The scheme provided in the embodiments of the invention is benefit to promote product miniaturization, integration and cost control.

The diagnostic device comprises a receiving means for receiving process variable values (x(t)) of a process variable of a process medium of a process, a measurement processing means for extracting and recording measurement statistics data from such process variable values, which are measured during a measuring phase, a training processing means for extracting and recording training statistics data from such process variable values, which are measured during a training phase, and a comparison means for comparing the measurement statistics data with training statistics data recorded before the measurement statistics data. Preferably, the training statistics data include a training empirical statistical distribution, which can be a distribution of a function of process variable values, which are measured during a training phase, or a distribution of a function of coefficients X_t(k), which are coefficients of a function of a transform of process variable values (x(t)), which are measured during a training phase.

The invention relates to a high-voltage transformer bushing tap grounding on-line monitoring device, which comprises three tap grounding detection devices, a sampling transmission device, a remote monitoring device and a solar battery pack, wherein the three tap grounding detection devices are connected with the sampling transmission device by cables, the sampling transmission device is in wireless communication connection with the remote monitoring device, and the solar battery pack is connected with the sampling transmission device. Through the tap grounding device, the transformer bushing tap grounding is more reliable; and the transformer bushing tap grounding current is detected through measurement coils arranged in the tap grounding device, the sampling voltage output by the measurement coils is led out through measurement leads and used as an input signal of the sampling transmission device, the sampling transmission device outputs the signal to the remote monitoring device, and the tap grounding current can be continuously monitored through the remote monitoring device. The device realizes real-time remote continuous monitoring of the transformer bushing tap grounding current state, and is reliable and stable in working state.

The present invention discloses a tap grounding apparatus used for a transformer bushing. The transformer bushing comprises a base flange provided with a first mounting hole; the tap grounding apparatus comprises a grounding seat, a grounding post and an insulating seat; the insulating seat is fixed in the first mounting hole; a second mounting hole is formed in the insulating seat; the grounding post is fixed in the second mounting hole; a grounding seat cover is arranged on the first mounting hole and fixedly connected to the base flange; the upper end of the grounding post is detachably connected to the grounding seat; one of the grounding seat and the grounding post is provided with a pin terminal; and the other of the grounding seat and the grounding post is provided with a jack capable of allowing the pin terminal to be inserted and connected. According to the tap grounding apparatus, the grounding reliability can be effectively improved and a poor grounding situation caused by a defect of a grounding connector can be conveniently discovered; and the tap grounding apparatus is simple in structure and low in manufacturing cost. The present invention also discloses a transformer bushing. The transformer bushing is provided with any tap grounding apparatus.

A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires (908) through use of a well know bonding process. A vacuum source holds the package (904) against the pedestal (902) deforming the resilient strips (920) located in the rigid member (902) of the pedestal and ensuring good contact between the ground pads of the package (904) and conductive resilient members (920). The resilient members (920) are conductive and electrically connect the package grounds to a system ground (922).

A low-cost noise suppressive technology using a general connector, reliably grounding to a shielding sheath of shielded cable at a low impedance by simple structure. The structure comprises conductive shielding covers attached to a chassis to enclose both sides of the second connector of non-shielded type at a tip of the shielded cable connected to the first connector mounted on the chassis and are fixed in a state to mate each other. Gaskets made of elastic material are respectively attached to inside of each shielding covers and made of conductive material being in electrical contact with the shielding cover. The gaskets are elastically contacted and conducted with the shielding sheath at an exposed portion of the shielded cable when the shielding covers are attached to the chassis to enclose the second connector and are fixed in the state to mate each other.

Embodiments of the invention discloses a PCB (printed circuit board), a PCB processing method and an electronic device. The PCB processing method can comprise: processing a hole on the PCB, wherein the PCB comprises a metal base and at least two layers of base materials, at least one layer of base material from the at least two layers of base materials being provided with a geoelectrical layer thereon and the metal base being fixedly arranged in a groove provided on the base materials, and the processed hole contacting both the geoelectrical layer and the metal base; and arranging a conductive substance in the hole, the conductive substance in the hole contacting the inner layer of the geoelectrical layer and the metal base so as to switch on the inner layer of the geoelectrical layer and the metal base. The scheme of the embodiments of the invention is favourable to improving the reliability of connection between the geoelectrical layer and the metal base of the PCB and improving the transmission performance of a high-frequency signal.

The invention discloses a test jack for a reactive controllable chip, which is composed of a chip holding plate (2), a grounded copper block (3), a probe positioning plate (6), a probe holding plate (7), a ground spring probe (4) and a signal/power supply spring probe (5). With the increasing running speed of integrated circuit chips, a chip test fixture which can meet the demand of test industry should include better high-frequency integrated signal so that reactance (impedance) thereof is within a certain range to reduce the loss of electric signals at the time of get-through. Meanwhile, according to the invention, use requirements can be satisfied only by conveniently replacing the probe positioning plate (6) instead of changing other parts when the distribution of contacts using different chips (1) is changed, thus greatly enhancing the processability of the test jack and lowering cost.

An intelligent alternative-direct-current integrated power supply system comprises a two-power-supply automatic switching device, an inversion module and a main monitor, which form an alternative-current/direct-current uninterrupted power supply system containing a uniform monitoring management function. By adopting a layered distributive architecture, the dispersed measure and control and centralized management can be realized. A communication storage battery group and a charging device are canceled, a direct-current/direct-current (DC/DC) conversion module is directly hung on a charging bus; an uninterrupted power supply (UPS) storage device is canceled, the inversion module is directly hung on the charging bus, and the inversion power supply is adopted for powering important loads such as a computer and accidental illumination; and the secondary power distribution management, the station power supply device intelligent management and state examination are uniformly carried out. The alternating current and direct current, the inversion and the communication power supply system of an entire transformer substation power supply can be uniformly monitored on one platform, the human resource can be uniformly dispatched, and the integral management level of the station power supply can be improved.

The invention discloses a semiconductor device test system and a test method thereof. The test system comprises an upper computer, an oscilloscope, a main control system PLC, a circuit control moduleand a test box body. An automatic tool is arranged in the test box body, a tested piece is placed on the automatic tool, and a test fixture is arranged right above the tested piece. The automatic toolcomprises a driving device, the driving device drives the automatic tool to move so as to drive the tested piece to be connected with the test fixture, and the main control system PLC is connected with the test box body, the test fixture, a main circuit unit and a gate pole driving unit. The upper computer is connected with the oscilloscope, and the oscilloscope is connected with the test box body. The advantages of the present invention are that the semiconductor device test system with a specific testing circuit and a testing system structure is designed, the theory is combined with the practice, and all devices in the system are matched with one another to test the semiconductor device.

A swivel bracket is coupled via a horizontal bracket to a clamp bracket to be mounted on a vessel. A trim mechanism adjusts a trim angle of an outboard motor by rotating the swivel bracket about the horizontal shaft. The trim mechanism includes a trim cylinder coupled to the clamp bracket and a trim rod that is projectable and retractable from the trim cylinder. A thrust receiver is attached to the swivel bracket. The thrust receiver receives a load from the trim rod. The thrust receiver is grounded. The thrust receiver includes a conducting portion in contact with the trim rod.

Disclosed is an electric connector having improved reliability and capable of being easily identified. A receptacle connector comprises a housing 10 insert-molded so that a receptacle shell 20 is embedded therein. The receptacle connector comprises a receptacle contact 30 and a receptacle earth contact 40. The receptacle earth contact 40 comprises a shell contacting part contacted to an outer circumference of the receptacle shell 20 and capable of being visible from an exterior of the receptacle connector 1.

The invention discloses a ground wire. The ground wire comprises a fixed clamp block and a movable clamp block matched with the fixed clamp block, a groove is formed in each of the fixed clamp block and the movable clamp block, a magnetic block is arranged on the edge of the groove of each of the fixed clamp block and the movable clamp block, a puncture needle is arranged in each groove, the fixed clamp block is fixed on a fixed block, the fixed block is fixed with an operating rod, a movable rod is arranged in the operating rod, the movable clamp block is movably connected with the movable rod through a connecting piece, a connecting rod is movably connected between the connecting piece and the fixed block, and the fixed block or the fixed clamp block is provided with a ground wire connecting device. The ground wire has advantages that an insulating wire is punctured to ground reliably, and the operation is easy to perform.

The embodiment of the invention provides an electromagnetic shielding film, a circuit board and an electromagnetic shielding film preparation method; the electromagnetic shielding film comprises a first shield layer, a second shield layer, a glue film and a plurality of convex particles; the first shield layer comprises a first surface and a second surface arranged in opposite; the second surfaceis a flat surface; the plurality of convex particles are attached to the second surface of the first shield layer; the second shield layer is configured on the second surface of the first shield layer, and covers the plurality of convex particles, thus forming convex portions, matched with the convex particles, on the outer surface of the second shield layer, and forming gentle portions on other positions; the glue film is configured on outer surface of the second shield layer, so the convex portions can ensure the shield layer to smoothly penetrate the glue film in lamination, thus ensuring interference charges to be normally conducted; in addition, the gentle portion of the second shield layer can reduce the insert loss in usage process; the electromagnetic shielding film is suitable forultrahigh frequency transmission.