Test jack for reactive controllable chip

Abstract

The invention discloses a test jack for a reactive controllable chip, which is composed of a chip holding plate (2), a grounded copper block (3), a probe positioning plate (6), a probe holding plate (7), a ground spring probe (4) and a signal / power supply spring probe (5). With the increasing running speed of integrated circuit chips, a chip test fixture which can meet the demand of test industry should include better high-frequency integrated signal so that reactance (impedance) thereof is within a certain range to reduce the loss of electric signals at the time of get-through. Meanwhile, according to the invention, use requirements can be satisfied only by conveniently replacing the probe positioning plate (6) instead of changing other parts when the distribution of contacts using different chips (1) is changed, thus greatly enhancing the processability of the test jack and lowering cost.

Description

technical field [0001] The invention belongs to the semiconductor industry, in particular to a testing device for semiconductor chips. Background technique [0002] With the increasing operating speed of integrated circuit chips, the chip testing industry requires chip test fixtures to have higher high-frequency signal integration performance. In the actual test of the chip, the test fixture must maintain the reactance (or impedance) within a certain range (for example, 50 ohms), so as to reduce the loss caused by the electrical signal passing through. However, none of the current chip test fixtures can meet the high requirements. frequency requirements. According to retrieval, before the present invention was made, no reactance controllable chip test socket identical to the present invention has been found. In the prior art, the main technical measure adopted at present is to shorten the contact probe connecting the chip and the circuit board as much as possible in an att...

AI Technical Summary

Problems solved by technology

In the existing technology, the main technical measures currently adopted are to shorten the contact probe connecting the chip and the circuit board as much as possible, in an attempt to obtain good high-frequency characteristics, but none of them can meet the requirements of machinability and low price

Similarly, the chip test socket in the prior art is generally composed of a chip holding plate, a chip socket main body and a probe holding plate, and for signal / power spring probes and grounding probes, the same spring probes are used. , which fundamentally determines that the reactance cannot meet the increasing frequency requirements

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