Electromagnetic shielding film, circuit board and electromagnetic shielding film preparation method

Abstract

The embodiment of the invention provides an electromagnetic shielding film, a circuit board and an electromagnetic shielding film preparation method; the electromagnetic shielding film comprises a first shield layer, a second shield layer, a glue film and a plurality of convex particles; the first shield layer comprises a first surface and a second surface arranged in opposite; the second surfaceis a flat surface; the plurality of convex particles are attached to the second surface of the first shield layer; the second shield layer is configured on the second surface of the first shield layer, and covers the plurality of convex particles, thus forming convex portions, matched with the convex particles, on the outer surface of the second shield layer, and forming gentle portions on other positions; the glue film is configured on outer surface of the second shield layer, so the convex portions can ensure the shield layer to smoothly penetrate the glue film in lamination, thus ensuring interference charges to be normally conducted; in addition, the gentle portion of the second shield layer can reduce the insert loss in usage process; the electromagnetic shielding film is suitable forultrahigh frequency transmission.

Description

technical field [0001] The invention relates to the field of electronics, in particular to an electromagnetic shielding film, a circuit board and a preparation method of the electromagnetic shielding film. Background technique [0002] With the rapid development of the electronics industry, electronic products are further developed toward miniaturization, light weight, and high-density assembly, which greatly promotes the development of flexible circuit boards, thereby realizing the integration of component devices and wire connections. Flexible circuit boards can be widely used in industries such as mobile phones, liquid crystal displays, communications and aerospace. [0003] Driven by the international market, functional flexible circuit boards dominate the flexible circuit board market, and an important indicator for evaluating the performance of functional flexible circuit boards is electromagnetic shielding (Electromagnetic Interference Shielding, referred to as EMI Sh...

AI Technical Summary

Problems solved by technology

However, during high-frequency transmission, the conductive particles in the conductive adhesive layer will generate eddy current loss, which will increase the insertion loss of the circuit board and affect the integrity of signal transmission.

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