Single thin plate storage container

Abstract

A single thin plate storage container is provided so that a housed semiconductor wafer is capable of easy insertion and removal. The single thin plate storage container includes a container body which houses a single semiconductor wafer therein and a lid unit attached to the container body. The container body includes a bottom plate on which the semiconductor wafer is placed and a peripheral wall portion formed around the bottom plate, and the bottom plate is formed by protruding up to a position higher than the peripheral wall portion. The bottom plate of the container body is provided with a plurality of thin plate supporting convex strips for supporting the semiconductor wafer in a state where a space is provided between the semiconductor wafer and the bottom plate. The inner side surface of the top plate of the lid unit is provided with a plurality of retainers which support a peripheral portion of the semiconductor wafer placed on the bottom plate of the container body.

Description

technical field [0001] The invention relates to a single-chip storage container for storing thin plates such as semiconductor wafers, storage discs, and liquid crystal glass substrates, and used in the processes of storage, transportation, and processing. Background technique [0002] A single-chip storage container for storing thin plates such as semiconductor wafers, storing them, transporting them, etc. is widely known. As an example of such a single-chip storage container, Japanese Patent Application Publication No. 5-508747 discloses a package for robots. The package for the robot includes a compartment for storing wafers. The wafers are inserted into the chamber for storage, transportation, and other operations. [0003] Furthermore, there is also a one-piece storage container comprising a platter-shaped container body and a lid. [0004] However, it is not easy to take out and put in the wafer from the magazine in the package for the robot described above, so the w...

AI Technical Summary

Problems solved by technology

[0004] However, it is not easy to take out and put in the wafer from the bin in the above-mentioned package for robots, so the workability is poor.

[0005] In this regard, for a single-chip storage container including a platter-shaped container body and a lid, compared with the above-mentioned package for robots, it is easier to take out and put in the wafer, but at this time, it is still necessary to take out the wafer from above. chip

For the disc-shaped container body, there is a wall of the container body around the stored wafers, so it is not possible to insert the vacuum tweezers of the transport device from the lateral direction

Therefore, there is a technical defect that the wafer must be taken out from above, and its workability is poor.

[0006] In addition, if the size of the wafer is enlarged, it is not easy to support only the peripheral portion of the wafer and lift it upward in terms of strength, so this point also brings a technical defect of poor workability.

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