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Semiconductor device

A semiconductor and conductive pattern technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of induced noise interference, offset predetermined value, etc.

Inactive Publication Date: 2007-01-10
SANYO ELECTRIC CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When operating electronic equipment, etc., the inductance may deviate from the predetermined value at the time of shipment due to inductive noise interference from circuit elements, etc. around the coil

Method used

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  • Semiconductor device
  • Semiconductor device
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Experimental program
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Embodiment Construction

[0034] At least the following problems will become clearer through the description in this specification and the description of the drawings.

[0035] "Structure of Semiconductor Devices"

[0036] A structural example of the semiconductor device 1 of the embodiment is described with reference to FIGS. 1A to 1C . FIG. 1A is a plan view of the upper side of a semiconductor device 1; Figure 1B is a side view of the semiconductor device 1; and FIG. 1C is a perspective view of the lower side of the semiconductor device 1 viewed from the upper side. Hereinafter, in this semiconductor device 1 , an IC chip side described later is referred to as an "upper side", and in the semiconductor device 1 , a coil side described later is referred to as a "lower side". As illustrated in FIGS. 1A and 1C , the semiconductor device 1 of this embodiment is a package having, for example, approximately square upper and lower sides. For example, the length of one side of the approximate square is ab...

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PUM

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Abstract

A semiconductor apparatus having a semiconductor chip, a first coil electrically connected to the semiconductor chip and a first electrode electrically connected to the first coil is comprised of a second electrode which can be electrically connected to the first electrode as well as which can be electrically connected to a second coil on the outside of the semiconductor apparatus, and is characterized by that inductance composed of the first coil and the second coil is obtained by electrically connecting the second electrode to the first electrode and the second coil.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of Japanese Patent Application Nos. 2005-15818 and 2005-329185 filed on January 24, 2005 and November 14, 2005, respectively, which are hereby incorporated by reference. technical field [0003] The invention relates to a semiconductor device having a coil. Background technique [0004] Recently, small-sized electronic devices, such as cellular phones, portable audio devices, PDAs, digital cameras, and the like, are widely popular. These electronic devices are required to become smaller, have more functions, have higher performance, and so on. Therefore, if electronic devices are manufactured, packaging processes and the like are required to achieve higher densities (for example, see Japanese Patent Application Laid-Open No. 2002-93847). [0005] In order to meet such demands, recently, for example, an AM / FM tuner is constructed by one (1) package (semiconductor device) and provide...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488
CPCH01L2924/14H01L2924/01078H01L2924/19041H01L2224/73265H01L2224/49171H01L2924/30107H01L2224/48227H01L2224/32225H01L2924/181
Inventor 佐藤明弘关口智镰土清和坪野谷诚三田清志锅田洋一
Owner SANYO ELECTRIC CO LTD