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Multiple flexible wiring board, method for producing same, method for producing flexible wiring board, and flexible wiring board

A manufacturing method and wiring board technology, which are applied in the directions of printed circuit manufacturing, simultaneous processing of multiple printed circuits, secondary processing of printed circuits, etc., can solve the problems of complex condition setting and the like

Inactive Publication Date: 2007-05-23
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this method, the condition setting is complicated, and there are many cases where it is difficult to adjust, so it is difficult to solve the problem

Method used

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  • Multiple flexible wiring board, method for producing same, method for producing flexible wiring board, and flexible wiring board
  • Multiple flexible wiring board, method for producing same, method for producing flexible wiring board, and flexible wiring board
  • Multiple flexible wiring board, method for producing same, method for producing flexible wiring board, and flexible wiring board

Examples

Experimental program
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Effect test

Embodiment Construction

[0054] Hereinafter, an embodiment of the present invention will be described based on the drawings.

[0055] (Embodiment 1)

[0056] Based on FIG. 1, FIG. 2, FIG. 3(A), and FIG. 3(B), the multi-connected flexible wiring board, its manufacturing method, and the flexible wiring board of Embodiment 1 of this invention are demonstrated.

[0057] Fig. 1 is an exploded perspective view of a multi-connected flexible wiring board according to Embodiment 1 of the present invention. Fig. 2 is a plan view of a multi-connected flexible wiring board according to the first embodiment of the present invention. 3(A) and 3(B) are cross-sectional views showing a cross section at arrow III in FIG. 2, and FIG. 3(A) is a laminated state in a temporary fixing step before thermocompression bonding, and FIG. 3(B) ) Indicates the laminated state after thermocompression bonding in the pressure bonding process.

[0058] The multi-connected flexible wiring board 1 has a first wiring substrate 12, a first cov...

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Abstract

One embodiment of a multiple flexible wiring board is a multiple flexible wiring board in which a plurality of flexible wiring boards are configured, and in which a first wiring base material, a first covering film layer, a second wiring base material, a second covering film layer, and an adhesive sheet that bonds the first wiring base material and the second wiring base material such that the first covering film layer and the second covering film layer are opposed, and has opening portions that have been formed corresponding to each of the plurality of flexible wiring boards, are layered. A hollow portion of each of the flexible wiring boards is formed between the first wiring base material and the second wiring base material by the opening portions, and auxiliary opening portions are formed alongside the opening portions.

Description

[0001] This application claims priority based on Patent Application No. 2005-331867 filed in Japan on November 16, 2005. By mentioning it, all its contents are included in this application. Technical field [0002] The present invention relates to a multi-connected flexible wiring board in which a plurality of flexible wiring boards with bending resistance are dispersedly arranged and a manufacturing method thereof, as well as a flexible wiring board and a manufacturing method thereof. Background technique [0003] The multi-connected flexible wiring board, its manufacturing method, and the flexible wiring board in the conventional example will be described based on FIGS. [0004] Fig. 14 is an exploded perspective view of a multi-connected flexible wiring board in a conventional example. Fig. 15 is a plan view of a multi-connected flexible wiring board in a conventional example. 16(A) and 16(B) are cross-sectional views showing the cross section at arrow XVI in FIG. 15, and FIG. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/00H05K3/28
CPCH05K3/0097H05K1/0393H05K3/0052H05K3/281H05K3/386H05K2203/0182H05K2203/0191H05K2203/063H05K2203/1536
Inventor 下村广伸
Owner SHARP KK
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