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Heat sink

a technology of heat sink and heat sink, which is applied in the direction of basic electric elements, semiconductor devices, lighting and heating apparatus, etc., can solve the problems of affecting the efficiency of cooling components, components of electronic devices such as servers, and generating a great deal of hea

Inactive Publication Date: 2013-06-13
HON HAI PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present patent is about a heat sink used to cool electronic components. The technical effect of the invention is to improve the efficiency of cooling by addressing the airflow that affects the cooling process. The heat sink includes a base and a plurality of fins and heat poles that are designed to optimize airflow and reduce air resistance. This improves the cooling efficiency of the electronic components and ensures continued proper functioning of the electronic devices.

Problems solved by technology

With the continuing development of electronic technology, components of electronic devices, such as servers, generate a great deal of heat.
However, one part of the airflow will flow through an outside the heat sink, which affects the efficiency of cooling the components.

Method used

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Embodiment Construction

[0009]The disclosure, including the accompanying drawing, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.

[0010]Referring to FIG. 1 to FIG. 3, an embodiment of a heat sink includes a base 10, a plurality of fins 20 extending up from the base 10, and a plurality of heat poles 30.

[0011]The base 10 includes a main body 12, and four mounting portions 14 respectively extending out from four corners of the main body 12. The main body 12 has a trapezium cross-section and includes two inclined guiding surfaces 122 formed at opposite sides of the main body 12. Each mounting portion 14 defines a mounting hole 142 for fixing the main body 12 to a motherboard (not shown).

[0012]The fins 20 include a plurality of parallel first fins 22 and two second fins 24 sandwiching the first fins 22. Each second fin 24 includes a m...

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Abstract

A heat sink includes a base and a number of fins perpendicularly extending from the base. The base includes a main body. The fins include a number of parallel first fins and two second fins sandwiching the first fins. Each second fin includes a main piece extending from the main body and a guiding piece extending from one end of the main piece.

Description

BACKGROUND[0001]1. Technical Field[0002]The present disclosure relates to a heat sink.[0003]2. Description of Related Art[0004]With the continuing development of electronic technology, components of electronic devices, such as servers, generate a great deal of heat. The heat needs to be dissipated immediately to ensure the continued proper function of the electronic devices. Often, a heat sink is arranged on the component to dissipate heat. A plurality of fans is arranged at a side of the electronic device to generate airflow to flow through the heat sink. However, one part of the airflow will flow through an outside the heat sink, which affects the efficiency of cooling the components.BRIEF DESCRIPTION OF THE DRAWINGS[0005]Many aspects of the present embodiments can be better understood with reference to the following drawing. The components in the drawing are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present e...

Claims

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Application Information

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IPC IPC(8): F28F7/00
CPCF28F3/02H01L23/467H01L23/3672F28F13/06H01L2924/0002H01L2924/00
Inventor WEI, CHAO-KE
Owner HON HAI PRECISION IND CO LTD