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Heat dissipation fin set

a technology of heat dissipation fins and sets, which is applied in the direction of basic electric elements, lighting and heating apparatus, tubular elements, etc., can solve the problems of affecting the total efficiency of heat dissipation, and the spare room in the electronic device is not enough

Inactive Publication Date: 2016-06-02
INVENTEC PUDONG TECH CORPOARTION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent text explains that as electronic devices become smaller and lighter, there is not enough space for efficient heat dissipation. Larger heat dissipation fins and heat pipes are not allowed, and the heat dissipation fins may affect air flow and reduce efficiency. This can result in reduced heat dissipation and affect the overall performance of the electronic device.

Problems solved by technology

However, since the electronic devices become smaller and lighter than before, there is no enough spare room within the electronic device to perform heat convection, and larger heat dissipation fin set and the heat pipe are not allowed to be disposed therein.
Accordingly, when the velocity of the air flow is reduced, the air flow cannot efficiently dissipate the heat swiftly, thereby affecting the total efficiency of the heat dissipation.

Method used

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Embodiment Construction

[0019]In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.

[0020]The disclosure provides a heat dissipation fin set which is adapted to electronic devices, such as, but not limited to, a desktop computer, a server, a laptop computer, an all-in-one computer, a smart phone (i.e., a handset). In this disclosure, the heat dissipation fin set is for performing heat dissipation on a heat source of an electronic device.

[0021]The following introduces the heat dissipation fin set. Please refer to FIG. 1 to FIG. 3. FIG. 1 is a schematic perspective view of a heat dissipation fin set according to an embodiment of the disclosure, FIG. 2 is an exploded ...

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PUM

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Abstract

A heat dissipation fin set includes a first fin; and a second fin. The second fin is adjacent to and parallel to the first fin. A projection plane is defined as being parallel to the first fin and the second fin. If the first fin and the second fin are projected onto the projection plane to form a plurality of projection profiles respectively, the plurality of projection profiles are different from each other.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 201410707240.5 filed in China on Nov. 27, 2014, the entire contents of which are hereby incorporated by reference.BACKGROUND OF THE INVENTION[0002]1. Technical Field of the Invention[0003]The disclosure relates to a heat dissipation fin set, and more particularly to a heat dissipation fin set with multiple heat dissipation fins.[0004]2. Description of the Related Art[0005]With the development of technology in recent years, speeds of computing of electronic devices are faster than before, and the electronic devices are miniaturized. In order to meet the requirement of consumers, the electronic devices are developed to be smaller in size and light in weight.[0006]When the speed of computing of the electronic device is increased, much heat is generated accordingly. In order to dissipate the heat generated, a better heat dissipation module is...

Claims

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Application Information

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IPC IPC(8): F28F3/00
CPCF28F3/00F28D15/0275F28F1/30H01L23/3672H01L23/427H01L21/4882F28D15/0233
Inventor CHENG, YI-LUNYANG, CHIH-KAI
Owner INVENTEC PUDONG TECH CORPOARTION