Ultrasound transducer arrangement and assembly, coaxial wire assembly, ultrasound probe and ultrasonic imaging system

a transducer and ultrasonic imaging technology, applied in the direction of mechanical vibration separation, catheters, applications, etc., can solve the problems of difficult reconciliation, difficult to achieve a sufficiently compact ultrasonic scanner in this manner, and difficult to reconcile, so as to facilitate a straightforward connection, compact and rigid ultrasound, reliable use

Inactive Publication Date: 2021-02-04
KONINKLIJKE PHILIPS NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This solution enables a compact, rigid, and high-resolution ultrasound probe capable of acquiring images in small spaces, such as cardiac volumes, without the need for a separate PCB, enhancing miniaturization and operational flexibility.

Problems solved by technology

Miniaturization is a particular challenge when developing ultrasound probes.
These requirements are difficult to reconcile with the desire to include significant signal processing capability at the probe.
However, it is not straightforward to achieve a sufficiently compact ultrasonic scanner in this manner.
However, the minimum dimensions of the PCB and discrete components typically preclude sufficient miniaturization to facilitate use of such probes in dimensionally challenging environments, e.g. cardiac environments.
Yet another disadvantage of the array shown is US 2010 / 0280388 A1 is its limited field of view in the forward looking direction.

Method used

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  • Ultrasound transducer arrangement and assembly, coaxial wire assembly, ultrasound probe and ultrasonic imaging system
  • Ultrasound transducer arrangement and assembly, coaxial wire assembly, ultrasound probe and ultrasonic imaging system
  • Ultrasound transducer arrangement and assembly, coaxial wire assembly, ultrasound probe and ultrasonic imaging system

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Embodiment Construction

[0043]It should be understood that the Figures are merely schematic and are not drawn to scale. It should also be understood that the same reference numerals are used throughout the Figures to indicate the same or similar parts.

[0044]Embodiments of the present invention are directed to the provision of a compact and rigid ultrasound probe tip where the rigidity of the tip can be provided without the need for a printed circuit board (PCB). To this end, a plug and socket type arrangement has been devised in which an ultrasound transducer assembly and a coaxial wire assembly are directly mated to connect the ultrasound transducer assembly to a flexible lumen such as a flexible catheter, in contrast to prior art arrangements in which the ultrasound transducer assembly is typically mounted to a PCB onto which the coaxial wires are soldered. As previously explained, these prior art arrangements cannot achieve the desired miniaturization of the ultrasound probe tip due to the size constrai...

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Abstract

An ultrasound transducer arrangement (100) is disclosed comprising a plurality of substrate islands (110, 120, 130) spatially separated and electrically interconnected by a flexible polymer assembly (150) including electrically conductive tracks providing said electrical interconnections, said plurality including a first substrate island (110) comprising a plurality of ultrasound transducer cells (112) and a second substrate island (120) comprising an array of external contacts for connecting the ultrasound sensor arrangement to a flexible tubular body including a coaxial wire assembly (200) comprising a plurality of coaxial wires (220) each having a conductive core (228) covered by an electrically insulating sleeve (226); and an electrically insulating body (210) having a first main surface (211), a second main surface (213) and a plurality of through holes (212) each extending from the first main surface to the second main surface and coated with an electrically conductive member, wherein each coaxial wire comprises an exposed terminal core portion mounted in one of said though holes from the first main surface, and wherein each through hole is sealed by a solder bump (214) on the second main surface such that the ultrasound transducer arrangement can be directly mounted on the flexible tubular body without the need for a PCB.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a continuation of U.S. application Ser. No. 15 / 326,055, filed Jan. 13, 2017, which is the U.S. National Phase application under 35 U.S.C. § 371 of International Application No. PCT / EP2015 / 064365, filed on Jun. 25, 2015, which claims the benefit of EP Application Serial No. 14177454.7 filed Jul. 17, 2014. These applications are hereby incorporated by reference herein.FIELD OF THE INVENTION[0002]The present invention relates to an ultrasound transducer arrangement comprising a plurality of substrate islands spatially separated and electrically interconnected by a flexible polymer assembly.[0003]The present invention further relates to an ultrasound transducer assembly including such an ultrasound transducer arrangement.[0004]The present invention yet further relates to a coaxial wire assembly for mating with the ultrasound transducer assembly.[0005]The present invention still further relates to an ultrasound probe includ...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): B06B1/02B06B1/06A61B8/12A61B8/00H01R4/02H01R12/51
CPCB06B1/0292B06B1/0622A61B8/12H01R12/515A61B8/4494H01R4/023A61B8/445
InventorHENNEKEN, VINCENT ANDRIANUSLOUWERSE, MARCUS CORNELISWEEKAMP, JOHANNES WILHELMUSDEKKER, RONALDNOTTEN, MARC GODFRIEDUS MARIEVAN RENS, ANTONIA CORNELIA JEANNET
OwnerKONINKLIJKE PHILIPS NV