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Liquid-cooled radiating system

A heat dissipation system and liquid cooling technology, applied in cooling/ventilation/heating transformation, electrical components, electric solid devices, etc., can solve the problems of inability to achieve timely, high-efficiency heat exchange, wasting energy, burning computer chips, etc., to save energy The effect of energy, power saving and component loss reduction

Inactive Publication Date: 2008-12-24
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when the heat generated by the computer chip is small, the energy used to drive the power pump will be wasted; when the heat generated by the computer chip is large, it will be impossible to achieve timely and efficient heat exchange, and even burn the computer chip

Method used

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  • Liquid-cooled radiating system

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Embodiment Construction

[0010] Generally, when there is a temperature difference between opposite end surfaces of a thermoelectric material, an electromotive force E is generated between the two end surfaces. This is the Siberk effect. The electromotive force generated due to the Siberk effect is called thermoelectric electromotive force. If the thermoelectric material is made into a thermoelectric converter and placed in a loop, when there is a temperature difference between the opposite ends of the thermoelectric converter, a current will be generated at the electrical output of the thermoelectric converter, and the current will flow along the loop. back to the electrical input of the thermoelectric converter, thereby forming an electrical loop.

[0011] Below, the present invention will be further described in detail in conjunction with the accompanying drawings.

[0012] see figure 1 , the liquid-cooled heat dissipation system 1 of the preferred embodiment of the present invention includes: a ...

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Abstract

The liquid cooling heat dissipation system provided by the present invention includes a heat dissipation element with a heat dissipation part; a working fluid circulating in the liquid cooling heat dissipation system; a condensation part for condensing the working fluid flowing out of the heat dissipation part; A pump for circulating the working fluid; the heat dissipation element further includes a thermoelectric conversion part close to the heat dissipation part, the thermoelectric conversion part is electrically connected to the pump, and is used to provide power to the pump. The liquid-cooled heat dissipation system can dissipate heat in a timely and efficient manner, and in addition, can save energy.

Description

【Technical field】 [0001] The invention relates to a heat dissipation system, in particular to a liquid-cooled heat dissipation system. 【Background technique】 [0002] With the advancement of science and technology, the processing speed of various electronic devices, such as computers, printers, copiers, etc., has become increasingly high-speed, resulting in a corresponding increase in the heat generated inside the above-mentioned electronic devices. The current heat dissipation method is generally in electronic components such as chips A heat dissipation fan is installed on the top to assist heat dissipation by air cooling, but the heat dissipation efficiency of the heat dissipation fan is limited, and the effect on reducing the temperature of the chip is poor, and there will be noise when the fan is running. [0003] In order to solve the problem of low heat dissipation efficiency and noise of the cooling fan, a liquid-cooled heat dissipation device has begun to appear, whi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/473H05K7/20
CPCH01L2924/0002H01L2924/00
Inventor 简士哲
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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