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Single petrochemical fluid jet device and its production method

A technology of fluid jetting and manufacturing method, which is applied in liquid jetting device, jetting device, printing and other directions, can solve the problems of short service life of fluid jetting device, increased process and difficulty, etc.

Inactive Publication Date: 2009-05-06
BENQ CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the deposition of a general silicon oxide film requires a relatively high temperature, and hydrofluoric acid is required to etch and remove the silicon oxide layer, the difficulty of the process is increased.
In addition, because in the existing monolithic fluid injection device 1, the structural layer is mainly composed of silicon nitride, while the sacrificial layer is composed of silicon oxide, and the materials of the two layers are similar in properties (both are dielectric materials), Therefore, it is often unavoidable to remove part of the structural layer when removing the sacrificial layer, and the durability of the monolithic fluid injection device is related to the strength of the silicon nitride structural layer, and a thinner structural layer will results in a shorter service life of the fluid ejection device

Method used

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  • Single petrochemical fluid jet device and its production method
  • Single petrochemical fluid jet device and its production method
  • Single petrochemical fluid jet device and its production method

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0021] 2A-2I are process cross-sectional views showing the single petrochemical fluid injection device 100 according to the first embodiment of the present invention.

[0022] First, please refer to FIG. 2A , a resistive layer and a conductive layer (not shown) are continuously deposited on the first surface 111 of the substrate 110 . The resistive layer and the conductive layer are patterned simultaneously by a photolithographic etching process, and then the conductive layer is patterned by a photolithographic etching process to expose part of the resistive layer, thereby forming the heating unit 120 and the signal transmission line 130 . The present invention has no special limitation on the materials of the heating unit 120 and the signal transmission line 130 , and may be any suitable material. In a preferred embodiment of the present invention, the resistive layer can be, for example, HfB2, TaAl, or TaN, and the conductive layer can be, for example, Al, Cu, or AlCu.

[0...

Embodiment 2

[0032] 3A-3I are process cross-sectional views showing a single petrochemical fluid injection device 300 according to Embodiment 2 of the present invention.

[0033] First, referring to FIG. 3A , a resistive layer and a conductive layer (not shown) are continuously deposited on the first surface 311 of the substrate 310 . The resistive layer and the conductive layer are patterned simultaneously by a photolithographic etching process, and then the conductive layer is patterned by a photolithographic etching process to expose part of the resistive layer, thereby forming the heating unit 320 and the signal transmission line 330 . The present invention has no special limitation on the materials of the heating unit 320 and the signal transmission line 330 , and may be any suitable material. In a preferred embodiment of the present invention, the resistive layer can be, for example, HfB 2 , TaAl, or TaN, and the conductive layer can be, for example, Al, Cu, or AlCu. .

[0034] Ne...

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Abstract

The invention relates to a method for producing single petrified fluid ejector, which comprises: providing a base which has the first and second surfaces; forming signal transfer line and heating unit on the first surface; forming the protective layer to cover the signal transfer line and the heating unit; forming plating initialize layer to cover the first surface; forming the first patterned photoresist layer on the plating initialize layer, to define the sacrificial layer preset section; forming sacrificial layer in the sacrificial layer preset section; removing the first photoresist layer; forming the second patterned photoresist layer on the sacrificial layer and the plating initialize layer, to define the structure layer preset section; forming the structure layer in the structure layer preset section; removing the second photoresist layer, to form one ejection hole through said structure layer; the second surface forms one fluid channel to pass through said base, and expose the sacrificial layer; and removing the sacrificial layer to form one fluid chamber connected with ejection hole.

Description

technical field [0001] The invention relates to a method for manufacturing a single petrochemical fluid injection device, in particular to an improvement in the manufacturing process of a single petrochemical fluid injection device. Background technique [0002] At present, the fluid injection technology has been widely used in various technical fields, such as printer inkjet heads, fuel injection devices, or biomedical systems such as pharmaceutical injection mechanisms and other technical products. [0003] Existing fluid injection devices can be divided into two types: nozzle hole sheet bonding and single petrochemical process. Among them, the nozzle hole sheet bonding uses a semiconductor process to form a heating element and a passivation protective layer, and then uses a photosensitive thick film photoresist The fluid cavity and flow channel are fabricated on the heating element, and then the orifice sheet is aligned and bonded to the thick film photoresist to complete...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41J2/14B41J2/16B05B17/04
Inventor 胡宏盛陈苇霖徐德荣
Owner BENQ CORP