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Method for preparing antistatic high foaming material

A high-foaming, antistatic technology, used in chemical instruments and methods, other chemical processes, etc.

Active Publication Date: 2010-12-08
EVA GLORY INDAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010]Second, general antistatic products can be divided into three grades according to their different volume resistance values, namely: (a) Conductive: volume The resistance is in the range of 104~106Ω-cm, (b) Electric Static Dissipative: the volume resistance is 106 ~108Ω-cm range, (c) Anti-static level (Anti-static): volume resistance in 109~1012 The range of Ω-cm, among them, the conductive level is the level with the best antistatic effect. According to the aforementioned classification standards, the volume resistance of the foamed material produced by this existing method is 106~ 109Ω-cm, showing that the best antistatic level can only reach the static dissipative level, which has the disadvantage of relatively poor antistatic effect

Method used

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  • Method for preparing antistatic high foaming material
  • Method for preparing antistatic high foaming material
  • Method for preparing antistatic high foaming material

Examples

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Comparison scheme
Effect test

specific example 1

[0041] 【Example 1 (Secondary molding and foaming)】

[0042]

[0043] Mixing temperature: 115°C

[0044] One-time molding pressure: 150kg / cm 2

[0045] Primary molding temperature: 150°C

[0046] Secondary molding pressure: normal pressure

[0047] Secondary molding temperature: 155°C

specific example 2

[0048] [Specific example 2 (secondary molding and foaming)]

[0049]

[0050] Mixing temperature: 120°C

[0051] One-time molding pressure: 150kg / cm 2

[0052] Primary molding temperature: 149°C

[0053] Secondary molding pressure: normal pressure

[0054] Secondary molding temperature: 155°C

specific example 3

[0055] [Specific example three (secondary molding and foaming)]

[0056]

[0057] Mixing temperature: 120°C

[0058] One-time molding pressure: 150kg / cm 2

[0059] Primary molding temperature: 151°C

[0060] Secondary molding pressure: normal pressure

[0061] Secondary molding temperature: 156°C

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Abstract

The invention discloses a preparation method of antistatic high foam material, consisting of the following steps: a foaming substrate, a conductive soot carbon and an additive component are provided and mixed for compounding and then a initial blank is injected and formed; the initial blank is arranged in a first foaming and molding mould to have a first coining and foaming and obtain a first foaming body; then, the first foaming body is arranged in a second foaming and molding mould to have a second coining and foaming to form a second foaming body, and the second foaming body is kept in themould to be cooled, thus obtaining the antistatic high foam material. Through twice of coining and a cooling process in the mould, the produced finished product possesses a low density and a good antistatic property. Therefore, the preparation method of the invention has the characteristics of further improving the quality of the antistatic high foam material product.

Description

technical field [0001] The invention relates to a method for preparing a foaming material, in particular to a method for preparing an antistatic high foaming material. Background technique [0002] Generally, when packaging electronic and electrical parts or instruments or devices with such parts, the packaging materials used should not only be light in weight so as not to increase the transportation burden, but also provide a protective covering capable of cushioning and shock absorption. In order to prevent the packaging materials from accumulating static electricity As a result, it is necessary to use materials with high cushioning, static electricity dissipation, and electromagnetic wave interference (Electro Magnetic Imterfering, referred to as EMI) shielding to make packaging materials. Foam technology Foam-molded antistatic foam is a packaging material commonly used in the electronics industry. [0003] refer to figure 1 , the preparation method of an existing antis...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C44/08B29C44/60B29C47/36B29C47/92B29C70/88C09K3/16B29K105/00B29K31/00B29K23/00B29K21/00B29C48/92
Inventor 李文生
Owner EVA GLORY INDAL