Method for preparing antistatic high foaming material

Abstract

The invention discloses a preparation method of antistatic high foam material, consisting of the following steps: a foaming substrate, a conductive soot carbon and an additive component are provided and mixed for compounding and then a initial blank is injected and formed; the initial blank is arranged in a first foaming and molding mould to have a first coining and foaming and obtain a first foaming body; then, the first foaming body is arranged in a second foaming and molding mould to have a second coining and foaming to form a second foaming body, and the second foaming body is kept in the mould to be cooled, thus obtaining the antistatic high foam material. Through twice of coining and a cooling process in the mould, the produced finished product possesses a low density and a good antistatic property. Therefore, the preparation method of the invention has the characteristics of further improving the quality of the antistatic high foam material product.

Description

technical field [0001] The invention relates to a method for preparing a foaming material, in particular to a method for preparing an antistatic high foaming material. Background technique [0002] Generally, when packaging electronic and electrical parts or instruments or devices with such parts, the packaging materials used should not only be light in weight so as not to increase the transportation burden, but also provide a protective covering capable of cushioning and shock absorption. In order to prevent the packaging materials from accumulating static electricity As a result, it is necessary to use materials with high cushioning, static electricity dissipation, and electromagnetic wave interference (Electro Magnetic Imterfering, referred to as EMI) shielding to make packaging materials. Foam technology Foam-molded antistatic foam is a packaging material commonly used in the electronics industry. [0003] refer to figure 1 , the preparation method of an existing antis...

AI Technical Summary

Problems solved by technology

[0009] One, the density of this antistatic foam material that the existing preparation method makes is relatively high (density is limited to 0.1g / cm 3 Above), the quality of the antistatic foam material made is also heavier. In addition to the relatively large number of raw materials used, it is also easier to increase the packaging weight and become a burden on transportation. If you want to use such as adding surface active Other methods such as agent or foaming agent, so that the density of the foam material is reduced to less than 0.1g / cm 3 When the foam is out of the mold, all the decomposed gas is released instantly, causing the foam to expand instantaneously. The violent expansion will easily lead to holes and tears in the foam, and there will be an increase in the defect rate of holes. It will also cause waste of raw materials, so that the existing production method has the defects of high product defect rate and low economic benefit

[0010] 2. Generally, antistatic products can be divided into three grades according to their different volume resistance values, namely: (a) Conductive grade (conductive): the volume resistance is 10 4 ~10 6 Ω-cm range, (b) Electrostatic Dissipative (Electric StaticDissipative): volume resistance in 10 6 ~10 8 Ω-cm range, (c) Anti-static level (Anti-static): the volume resistance is 10 9 ~10 12 The range of Ω-cm, wherein, the conductive level is the level with the best antistatic effect, according to the aforementioned classification standard, the volume resistance of the foamed material made by this existing method is 10 6 ~10 9 Ω-cm, showing that the best antistatic level can only reach the static dissipative level, which has the disadvantage of relatively poor antistatic effect

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