Method for manufacturing low-oxymethylene-releasing high-density fibreboard

A high-density fiberboard, low-formaldehyde release technology, used in manufacturing tools, flat products, pretreatment of molding materials, etc., can solve problems such as environmental pollution and damage, and achieve flexible production processes, low water absorption thickness expansion rate, and production costs. low effect

Active Publication Date: 2010-06-09
DARE WOOD BASED PANEL GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the formaldehyde component released slowly by the fiberboard during use inevitably pollutes the environment and harms the human body.

Method used

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  • Method for manufacturing low-oxymethylene-releasing high-density fibreboard
  • Method for manufacturing low-oxymethylene-releasing high-density fibreboard
  • Method for manufacturing low-oxymethylene-releasing high-density fibreboard

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Example 1 The method of the present invention is used to produce a grade E0 fiberboard board.

[0025] The production method comprises the steps of:

[0026] A) using pine, poplar or miscellaneous wood as the main raw material, through slicing and thermal grinding, to prepare fibers that meet the requirements;

[0027] B) Sizing: Before the fiber is dried, add urea-formaldehyde resin, formaldehyde scavenger and composite curing agent to the pipeline for fiber delivery to dry the fiber;

[0028] C) pavement, thermoforming;

[0029] D) Stacking, sanding and cutting after cooling to obtain finished products.

[0030] In the sizing process, the urea-formaldehyde resin used is purchased from the market, and its total molar ratio is 0.95; the formula of the formaldehyde scavenger is 5.0% sodium chloride, 1.0% ammonia water, 0.10% hexamethylenetetramine, 0.10% borax , 0.10% triethanolamine and 50.0% urea, and the rest is water; the composition of the composite curing agent ...

Embodiment 2～4

[0037] Examples 2 to 4 respectively adopt the method of the present invention to manufacture E0 or E1 fiberboard boards. Adopted processing step is the same as embodiment 1, and used synthetic resin, composite curing agent and formaldehyde trapping agent are all the same as example 1, and difference is that in the sizing operation, the specific conditions are different, parameters such as sizing are shown in Table 5, The properties of the prepared plates are shown in Table 6:

[0038] table 5

[0039]

[0040] Table 6

[0041]

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Abstract

The invention discloses a method for manufacturing a low formaldehyde release quantity high density fiberboard, which comprises sizing procedures. The method is characterized in that in the sizing procedure, E1 or E0 grade fiberboard used synthetic resin, a compound curing agent and a formaldehyde capture agent are adopted; sizing quantity accounts for 30-35% of fiber quantity; the application quantity of the compound curing agent accounts for 1.48-2.5% of the synthetic resin; and the application quantity of the formaldehyde capture agent accounts for 0.0-10.0%. According to the method, the whole mol ratio of urea formaldehyde resin is controlled in the range of 1.05-0.93; and with the addition of the formaldehyde capture agent, E1 or E0 grade fiberboards can be produced. The method has the advantages of low production cost, flexible production technique and strong adaptability. The produced fiberboard has the advantages of stable and excellent performance, and low free formaldehyde release quantity, and the formaldehyde release quantity can be flexibly controlled according to the users' requirements.

Description

technical field [0001] The invention relates to a method for manufacturing wood-based panels, in particular to a method for manufacturing high-density fiberboards with low formaldehyde emission and meeting environmental protection requirements. Background technique [0002] The conventional dry fiberboard manufacturing process uses air as the slab forming medium, and the moisture content of the formed slab is only 5-10%. Due to the lack of moisture in the slab, the pressure and temperature in the hot pressing process alone cannot form sufficient bonding force between the fibers, so a certain amount of adhesive must be added to improve the strength and water resistance of the finished product. [0003] Due to the excellent bonding performance and low cost of synthetic resin adhesives, synthetic resin adhesives are basically used in the wood industry and fiberboard manufacturing at present. Formaldehyde is contained in various synthetic resin adhesives currently used. [000...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B27N3/04B27N1/02C09J11/02C09J161/24
Inventor 史志华
Owner DARE WOOD BASED PANEL GRP
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