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Radiating structure of LED

A technology of light-emitting diodes and heat-dissipating structures, applied to semiconductor devices of light-emitting elements, light sources, point light sources, etc., can solve the problems of low luminous efficiency, large power consumption, poor heat dissipation, etc. The effect of prolonging life

Inactive Publication Date: 2010-06-09
刘雪峰
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the existing chip-packaged light-emitting diodes on the market have low luminous efficiency, high power consumption, and poor heat dissipation.
Poor use
Disadvantages of short life of light-emitting diodes

Method used

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  • Radiating structure of LED
  • Radiating structure of LED
  • Radiating structure of LED

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] figure 1 It is an overall assembly drawing of the LED heat dissipation structure of the present invention.

[0014] In the figure, the light-emitting diode heat dissipation structure includes a metal case 1, an encapsulation cover 2, a light-emitting diode 3, a mirror reflector 4, an anti-leakage silicone rubber 5, a mirror-reflective solid crystal heat conducting bracket 6, and a cooling liquid 7 for heat dissipation. The metal casing 1 is the casing of the light-emitting diode, and is used for dissipating the heat emitted by the light-emitting diode when it is working. The encapsulation cover 2 is on the top of the metal case 1 for encapsulating the LED 3 . The light emitting diode 3 is located in the center of the specular reflector 4 inside the encapsulation cover 2 . A part of the specular reflector 4 is inside the metal casing 1 , and a part extends upwards into the encapsulation cover 2 , and the reflective angle of the specular reflector 4 is 130°-160°. The a...

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Abstract

The invention provides a radiating structure of light emitting diodes and a manufacturing method thereof, the radiating structure comprises a metal outer casing, a package cover, light emitting diodes, mirror faced reflector, a leak-proof silicon rubber, a mirror faced reflecting die-bond heat-conducting support and radiating cooling fluid, wherein the metal outer casing is used to radiate heat generated by the operating light emitting diodes, the plastic package cover covering the top portion of the metal outer casing is used to package the light emitting diodes, the light emitting diodes are located at the central position of the mirror faced reflector, the mirror faced reflector is arranged at the upper portion inside the metal outer casing, the leak-proof silicon rubber is tightly connected with the lower end of the mirror faced reflector to prevent the cooling fluid from leaking, the mirror faced reflecting die-bond heat-conducting support arranged at the lower end of the mirrorfaced reflector is used to bond crystals and radiate, and the radiating cooling fluid is arranged at the lowest end of the metal outer casing.

Description

technical field [0001] The invention relates to the field of crystal light emitting technology, in particular to a heat dissipation structure of a light emitting diode. Background technique [0002] At present, the existing chip-packaged light-emitting diodes on the market have low luminous efficiency, high power consumption, and poor heat dissipation. It doesn't work well. The disadvantage of short life of light-emitting diodes. Contents of the invention [0003] The purpose of the present invention is to overcome the disadvantages of the prior art and provide an improved light emitting diode heat dissipation structure. [0004] A light-emitting diode heat dissipation structure, including a metal case, a package cover, a light-emitting diode, a mirror reflector, an anti-leakage silicone rubber, a mirror-surface reflective solid crystal heat conduction bracket, a heat dissipation cooling liquid, and a metal case, which are used to dissipate the heat emitted by the light-...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21V7/05F21V29/00H01L23/36H01L23/44F21Y101/02F21V29/56F21Y115/10
Inventor 刘雪峰
Owner 刘雪峰
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