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Electronic device

An electronic device and carrier technology, applied in the field of electronic devices, can solve the problem of not wanting to increase the size of the package

Active Publication Date: 2013-03-27
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, increasing the size of the package is generally undesirable since most customers / users require smaller packages than ever before

Method used

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Embodiment Construction

[0015] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and which show by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terms such as "top", "bottom", "front", "rear", "leading", "trailing", etc. are used herein with reference to the drawings (one or more ) in terms of orientation. Because elements of an embodiment may be positioned in many different orientations, directional terms are used for purposes of description rather than limitation. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. Therefore, the following detailed description is not to be taken in a limiting sense, but the scope of the invention is defined by the appended claims.

[0016] It should be understood that the features of the various exemplary embodiments describe...

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Abstract

Embodiments provide an electronic device including a carrier defining a first major surface, a chip attached to the first major surface, an array of leads connected to the first major surface, and a thickness of encapsulation material disposed on the first major surface of the carrier. Each lead extends through the thickness of the encapsulation material.

Description

technical field [0001] The present invention relates to electronic devices. Background technique [0002] Semiconductor packages protect the integrated circuit chips enclosed within them from environmental conditions such as thermal changes and vibrations. A semiconductor package includes a support carrier, one or more chips electrically coupled to the carrier, an encapsulation material molded over the carrier and chip(s), and an encapsulation material configured to Leads that connect to the "outside" world. [0003] Creepage is the distance between adjacent leads. For high voltage applications, it is desirable that the creepage distance be large enough to accommodate a sufficiently high voltage without arcing or electrical failure between adjacent leads. The creepage distance can be increased by increasing the size of the package, but this increases the length of the side peripheral edges of the package, thus increasing the spacing between adjacent leads extending from t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L23/31H01L21/50H01L21/60H01L21/56
CPCH01L2924/14H01L23/49517H01L23/49575H01L24/49H01L2924/1815H01L23/3107H01L2924/15787H01L2224/49111H01L2224/48472H01L2224/48137H01L24/48H01L2224/48091H01L2924/01068H01L23/49811H01L2224/48247H01L2924/181H01L2224/0603H01L2224/48095H01L2224/48139H01L2224/49431H01L2924/00014H01L21/56H01L25/072H01L2924/00H01L2924/00012H01L2224/45099H01L2224/45015H01L2924/207
Inventor A·克斯勒R·彼得斯W·肖伯
Owner INFINEON TECH AG