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Method and apparatus for mounting at least two types of electronic components

A technology for installing electronic components and electronic components, which is applied in the direction of assembling printed circuits, electrical components, electrical components, etc.

Inactive Publication Date: 2013-04-24
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the approach goes against the trend of miniaturizing electronics

Method used

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  • Method and apparatus for mounting at least two types of electronic components
  • Method and apparatus for mounting at least two types of electronic components
  • Method and apparatus for mounting at least two types of electronic components

Examples

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Embodiment Construction

[0030] Example embodiments will now be described more fully with reference to the accompanying drawings, in which example embodiments are shown.

[0031] Figure 1 to Figure 11 are a sectional view and a plan view for explaining a method of mounting at least two types of electronic components according to an exemplary embodiment of the present invention. Figure 1 to Figure 11 Mounting methods include surface mount packaging technology, in which electronic components are mounted on the same substrate by using at least two solder pastes.

[0032] exist Figure 1 to Figure 11 wherein the first electronic component has a first temperature limit, and the second electronic component has a second temperature limit lower than the first temperature limit. For example, the first electronic components include tall first electronic components and short first electronic components that can be mounted regardless of their heights.

[0033] refer to figure 1 , the first mask 20 is formed...

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Abstract

Provided is a method and apparatus for mounting a plurality of electronic components. The method comprises mounting a first electronic component on a substrate; forming a mask on the substrate to expose the first electronic component and a region of the substrate on which a solder paste is to be applied; forming a guide on a portion of the mask disposed around the first electronic component; applying the solder paste onto the substrate by using a squeezer contacting a portion of the mask disposed around the region of the substrate on which the solder paste is to be applied; removing the guide and the mask; and mounting a second electronic component on the solder paste.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2007-0129010 filed with the Korean Intellectual Property Office on December 12, 2007, which is hereby incorporated by reference. technical field [0002] The invention relates to a method and an apparatus for mounting electronic components on a substrate. Background technique [0003] There are many types of electronic products on the market, such as digital cameras, cellular phones, personal digital assistants (PDAs), MP3 players, and personal multimedia players. These electronic products are becoming more miniaturized for portability. Therefore, more electronic components, such as semiconductor devices, should be mounted in a smaller area in electronic products. [0004] Conventional methods of mounting electronic components include: printing solder paste onto a substrate; mounting electronic components onto the solder paste and reflow soldering the electronic components. [0005] Among the el...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34H05K13/04
CPCH05K2203/1476H05K3/3484H05K3/1225H05K2201/2027H05K3/3485Y10T29/49144H05K3/30
Inventor 金径宪金台勋金东熙
Owner SAMSUNG ELECTRONICS CO LTD