Check patentability & draft patents in minutes with Patsnap Eureka AI!

IC socket

A socket and base technology, applied in the field of flip-top IC sockets, can solve the problem of not determining the electrical connection of the IC socket, etc., and achieve the effect of easy testing and low-cost structure

Inactive Publication Date: 2009-08-05
3M INNOVATIVE PROPERTIES CO
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this point, the first position corresponds to a state where the object to be tested or the IC device (not shown) is still not fixed, that is, the object is not definitely electrically connected to the IC socket 100

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • IC socket
  • IC socket
  • IC socket

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The present invention is described below with reference to the accompanying drawings.

[0026] 1( a ) and FIG. 1( b ) are perspective views of a preferred embodiment of a clamshell type IC socket 1 according to the present invention, showing a closed state and an open state of the IC socket, respectively. figure 2 is an exploded perspective view of the IC socket of FIG. 1 . The IC socket 1 includes a base 2 placed on a detection device (not shown), such as figure 2 Shown is a cover 3 pivotally connected to the base 2 by a hinge pin 21 and a torsion spring 22, and a latch 4 for holding the cover 3 closed to the IC socket. A torsion spring 22 biases the cover 3 away from the base 2 . Therefore, when the latch 4 does not engage the cover 3 ( FIG. 1( b )), the cover 3 is opened, and an unshown object to be tested or an IC device can be arranged on the base 2 so that the IC device contacts are arranged on the base 2 Contact 23 on.

[0027] image 3 It is an exploded v...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The object of the present invention is to provide an IC socket having a constitution for simplifying the motion of an activating member for operating a lever, whereby the operation of the lever may be easily applied to an automated machine. A lever member 35 having the bifurcated shape includes first and second legs 353 and 354. In the first position, the first leg 353 operably projects from the base 2 and the lid 3. On the other hand, the second leg 354 is contained in the lid 3. When the actuating member 5 is moved to rotate the lever member 35 from the first position to the second position, the first leg 353 is contained in the lid 3 and the second leg 354 operably projects from the base 2 and the lid 3.

Description

technical field [0001] The present invention relates to an IC socket for electrically connecting a semiconductor integrated circuit (hereinafter referred to as "IC") device, and more particularly, to a clamshell type IC socket for testing an IC device. Background technique [0002] Japanese Unexamined Utility Model Patent Publication (Kokai) No. 2-148483 discloses an example of a clamshell type IC socket for performing burn-in tests in which electrical characteristics, durability, and heat resistance of IC devices are tested sex. The IC socket has contacts contacting the IC device, and the movement of the contacts in the vertical direction is improved so that reliable electrical contact between the contacts and the IC device can be obtained. [0003] Figure 7 is an external perspective view of an example of a conventional clamshell IC socket 100 . The IC socket 100 has a base 102 , a cover 103 pivotally connected to the base 102 , and a latch 104 for holding the cover 103...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01R33/76
CPCH05K7/1061H01R33/76
Inventor 太田稔男中村真一郎
Owner 3M INNOVATIVE PROPERTIES CO
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More