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Equipment and method for mounting electronic component

A technology for electronic devices and mounting devices, which is applied in the manufacturing of electrical components, electrical components, semiconductor/solid-state devices, etc., and can solve problems such as TCP mounting position deviation

Inactive Publication Date: 2009-11-18
SHIBAURA MECHATRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] Therefore, since the liquid crystal cell is not reliably supported and fixed by the upper end surface of the support tool, when the TCP is installed with the installation tool, the liquid crystal cell will slide, and the installation position of the TCP will be shifted.

Method used

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  • Equipment and method for mounting electronic component
  • Equipment and method for mounting electronic component
  • Equipment and method for mounting electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0024] figure 1 The mounting device shown has a base 1 . The base 1 is provided with a Y stage 2 . The Y stage 2 is driven in a Y direction perpendicular to the paper surface by a Y drive source 3 provided on one side surface of the above-mentioned base 1 .

[0025] An X stage 4 serving as a holding stage is provided on the Y stage 2 so as to be movable in an X direction perpendicular to the above Y direction. The X stage 4 is driven in the X direction perpendicular to the Y direction indicated by the arrow in the figure by the X drive source 5 provided on one side surface of the Y stage 2 .

[0026] The above-mentioned Y driving source 3 and X driving source 5 are composed of figure 2 The illustrated control device 6 controls the drive. That is, preset position information is input to the control device 6 through an input unit not shown, and the Y drive source ...

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PUM

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Abstract

Equipment for mounting electronic components comprises an X table (4), which has a holding plane (4a) for holding a liquid crystal cell (W) with one side thereof projected from the holding plane and is driven in the horizontal direction; a backup tool (8), which is driven vertically by a vertical drive means (12) and has an upper end face for supporting the lower surface of a liquid crystal cell at a part corresponding to the upper surface for mounting an electronic component (9) on one side; a mounting tool (21), which is driven vertically by a pressurization drive means (22) to mount the electronic component on the upper surface on one side of the liquid crystal cell whose lower surface is supported on the upper end face of the backup tool; a height sensor (7) for measuring the height of the lower surface at a part for mounting the electronic component on one side of the liquid crystal cell held on a holding table; and a controller for driving the vertical drive means based on the measurement of the height sensor to set the upper end face of the backup tool at the same height as the lower surface of the liquid crystal cell.

Description

technical field [0001] The present invention relates to a mounting device and a mounting method for holding the underside of one side of a substrate by a supporting tool and mounting an electronic device thereon by using a mounting tool. Background technique [0002] For example, TCP (Tape Carrier Package), which is an electronic device, is pressure-bonded to a liquid crystal cell as a substrate through an anisotropic conductive member as an adhesive material. The above-mentioned liquid crystal cell is composed of two glass plates bonded liquid-tightly at predetermined intervals through a sealing material, liquid crystal is sealed between these glass plates, and polarizing plates are attached to the outside of each glass plate. Next, the belt-shaped anisotropic conductive member was crimped on the side surface of the liquid crystal cell configured as above, and the TCP was temporarily crimped on the anisotropic conductive member, followed by final crimping. [0003] For cri...

Claims

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Application Information

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IPC IPC(8): H01L21/60G02F1/1345
CPCH05K3/0064G02F1/1303H05K13/04
Inventor 铃木正广
Owner SHIBAURA MECHATRONICS CORP