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Chemical resistant semiconductor processing chamber bodies

A technology for processing chambers and semiconductors, which is applied in the field of potential pollution sources, and can solve the problems of increasing contaminated substrates and solid processing chamber bodies

Inactive Publication Date: 2009-11-25
LAM RES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although plastic reduces possible sources of contamination, a chamber body made of plastic may not be as strong as a chamber body made of metal
However, using a metal chamber body increases the possibility of contaminating the substrate if the metal body is exposed to the processing fluid

Method used

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  • Chemical resistant semiconductor processing chamber bodies
  • Chemical resistant semiconductor processing chamber bodies
  • Chemical resistant semiconductor processing chamber bodies

Examples

Experimental program
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Embodiment Construction

[0019] Said invention serves to increase the chemical resistance of the chamber body used during the processing of semiconductor substrates. Embodiments of the present invention allow the chamber body to be made into any shape, particularly larger than a single substrate chamber, while maintaining structural integrity and resistance to chemicals used within the chamber. Today's feature sizes, down to the nanometer scale or even smaller, require minimizing possible sources of contamination. Wafer processing with highly reactive chemicals such as hydrofluoric acid (denoted by HF) occurs within a chamber body constructed of materials that do not produce harmful contaminants when exposed to HF. For example, utilizing plastics such as polyvinyl chloride (PVC) and polytetrafluoroethylene (PTFE) to form the chamber body reduces the possibility of contamination because these materials are inactive in the presence of HF. However, the use of plastics to form large process chamber bodie...

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Abstract

In one embodiment a chamber body enabling semiconductor processing equipment to be at least partially housed in the chamber body, the semiconductor processing equipment being configured to process a substrate using fluids is disclosed. The chamber body being comprised of a base material implemented to form the chamber body, the chamber body defined by at least a bottom surface and wall surfaces that are integrally connected to the bottom surface to enable capture of overflows of fluids during the processing of the substrate over the chamber body. Additionally, the base material is metallic. The chamber body also has a primer coat material disposed over and on the base material. The primer coat material has metallic constituents to define an integrated bond with the base material along with non-metallic constituents. The chamber body further includes a main coat material disposed over and on the primer coat material. The main coat material being defined from non-metallic constituents, the non-metallic constituents of the main coat material defining an integrated bond with the primer coat material. The main coat material defined to completely overlie all the metallic constituents of the primer coat.

Description

technical field [0001] The present invention relates generally to semiconductor processing equipment and, more particularly, to the confinement of semiconductor processing fluids and the reduction of potential sources of contamination from processing fluids that may act on the processing vessels. Background technique [0002] In the field of semiconductor processing, processing equipment exposes substrates to various highly active processing fluids. The activity of the treatment solution may cause contamination of the substrate and decrease in yield. In order to contain the processing liquid, the processing equipment using the processing liquid is placed in the processing chamber body made of non-reactive plastic. The use of non-reactive plastics allows the chamber body to minimize sources of contamination when the chamber body is exposed to the process fluid. While plastic can reduce possible sources of contamination, a chamber body made of plastic may not be as strong as...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D5/10
Inventor 郑荣阿诺德·霍洛坚科马克·曼德尔保埃姆格兰特·彭卡特里娜·米哈利钦科
Owner LAM RES CORP