Method for manufacturing light-emitting component array
A technology of light-emitting elements and arrays, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, and electric solid-state devices, etc., and can solve problems such as disconnected electrical connections, increased electrical connecting lines, and defects
Active Publication Date: 2012-03-21
EPISTAR CORP
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Problems solved by technology
However, due to the influence of the size of the trench, for example, the depth of the trench is too deep, when the electrical connection line is formed on the side wall of the trench, there will be disconnection or poor electrical connection.
The known solution is to increase the thickness of the electrical connection line to fill the trench or completely cover the sidewall of the trench to achieve good electrical connection; but increasing the thickness of the electrical connection line also increases the production cost
Method used
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Embodiment Construction
[0023] Such as figure 1 As shown, a wafer of light-emitting diodes 1 is provided, including a substrate 10 ; a light-emitting stack 12 is formed on the substrate 10 , wherein the light-emitting stack 12 at least includes a first semiconductor layer 122 , an active layer 124 and a second semiconductor layer 126 . Removing part of the light-emitting stack 12 to form a trench 14, wherein the trench 14 exposes part of the substrate 10, and separates the light-emitting stack 12 into a first light-emitting element 11 and a second light-emitting element 13. The removal method includes but is not limited to etch. Removing part of the second semiconductor layer 126 and light emitting layer 124 of the first light-emitting element 11 and the second light-emitting element 13 to expose part of the first semiconductor layer 122, wherein the removal method includes but not limited to inductively coupled plasma etching (Inductively Coupled Plasma; ICP). At this time, the upper surfaces of t...
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The invention discloses a method for manufacturing a light-emitting component array, which comprises the following steps: forming a light-emitting laminate on a substrate; removing part of the light-emitting laminate to form at least one groove and dividing the light-emitting laminate into a first light-emitting component and a second light-emitting component; removing a second semiconductor layer and a light-emitting layer of part of the first light-emitting component and the second light-emitting component to expose a first semiconductor layer of part of the first light-emitting component and the second light-emitting component; forming a second electrode on the second semiconductor layer and a first electrode on the exposed first semiconductor layer; forming an insulating layer on the light-emitting laminate and the groove, wherein the insulating layer seals the groove and forms at least one hole in the groove; and forming an electric connecting wire for electrically connecting the first electrode of the first light-emitting component and the second electrode of the second light-emitting component.
Description
technical field [0001] The invention relates to a method for manufacturing a light-emitting element array, in particular to a light-emitting element array with grooves closed by an insulating layer. Background technique [0002] A light emitting diode (Light Emitting Diode; LED) is a solid-state physical semiconductor element, and a light emitting diode array (LED Array) has a plurality of LEDs, which can be properly connected in series or in parallel as required. Before connecting in series or in parallel, it is necessary to form a groove to separate each LED, then form an insulating layer between the groove and the LED to electrically insulate each LED, and then form an electrical connection line on the insulating layer and electrically connect each LED. electrodes for series or parallel connection. However, due to the influence of the size of the trench, for example, the depth of the trench is too deep, disconnection or poor electrical connection may occur when electrica...
Claims
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IPC IPC(8): H01L21/82H01L27/15
Inventor 刘宗宪陈昭兴郭政达
Owner EPISTAR CORP