Probe unit

Abstract

Disclosed is a probe unit for suppressing decrease of permissible current caused by reduced probe diameter, comprising: a plurality of large-diameter probes; a plurality of small-diameter probes smaller in diameter than the large-diameter probes; a large-diameter probe holder including a plurality of large hole parts for individually holding the plurality of large-diameter probes and a plurality of receiving hole parts of smaller diameter than the large hole parts that communicate with any of the plurality of large hole parts and that receive the small-diameter probes in a state in which the end parts thereof are in contact with the large-diameter probes, a set of intercommunicating large hole parts and receiving hole parts passing therethrough in the thickness direction; and a small-diameter probe holder in which a plurality of small hole parts for individually holding the plurality of small-diameter probes in an engaged state are provided to pass therethrough in the thickness direction, and which is laminated on the large-diameter probe holder so that the small hole parts communicate with any of the plurality of receiving hole parts. The longitudinal center axes of the intercommunicating large hole parts and small hole parts are offset, and the center to center distance between two adjacent small hole parts of the plurality of small hole parts is smaller than the center to center distance between the two large hole parts respectively correspondent thereto.

Description

technical field [0001] The present invention relates to a probe unit for accommodating conductive probes for inputting and outputting signals in electrical characteristic inspections of semiconductor integrated circuits and the like. Background technique [0002] Conventionally, in the electrical characteristic inspection of a semiconductor integrated circuit such as an IC chip, a probe unit that accommodates a plurality of conductive probes in predetermined positions has been used in accordance with the arrangement pattern of the external electrodes included in the semiconductor integrated circuit. The probe unit includes a probe holder provided with a plurality of holes through which the contact probes can pass, and both ends of the conductive probes held by the probe holder are connected to the semiconductor integrated circuit and the circuit board for outputting the inspection signal, respectively. The electrodes come into contact with each other to electrically connect ...

AI Technical Summary

Problems solved by technology

However, if the maximum diameter or pitch of the semiconductor electrodes is less than 1 mm, the diameter of the probe must be reduced instead, resulting in a problem that the allowable current becomes smaller

In addition, if two probes are required to inspect one terminal during 4-terminal measurement, the allowable current has to be reduced due to the need for small-diameter probes.

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