Probe unit

Abstract

To prevent reduction in current-carrying capacity due to a reduced diameter of a probe, a probe unit includes the followings: a plurality of large diameter probes; a plurality of small diameter probes having diameters smaller than those of the large diameter probes; a large-diameter probe holder that includes a plurality of large hole portions which individually hold the large diameter probes, and a plurality of reception hole portions which have diameters smaller than those of the large hole portions, communicate with any one of the large hole portions, and receive end portions of the small diameter probes so that the end portions come into contact with the large diameter probes, while a set of the large hole portion and the reception hole portion that communicate with each other pierces through the large-diameter probe holder in a thickness direction; and a small-diameter probe holder that includes a plurality of small hole portions which individually hold the small diameter probes while preventing the small diameter probes from coming off and which pierce through the small-diameter probe holder, and that is stacked on the large-diameter probe holder so that each small hole portion communicates with any one of the reception hole portions. The central axes in a longitudinal direction of the large hole portion and the small hole portion that communicate with each other are separated from each other, and the small hole portions include two small hole portions which are adjacent to each other and of which central axes are separated from each other by a distance shorter than a distance between the central axes of two large hole portions that are corresponding to the two small hole portions.

Description

technical field [0001] The present invention relates to a probe unit for accommodating a conductive probe for inputting and outputting signals in electrical characteristic inspection of semiconductor integrated circuits and the like. Background technique [0002] Conventionally, in the electrical characteristic inspection of a semiconductor integrated circuit such as an IC chip, a probe unit that accommodates a plurality of conductive probes at predetermined positions corresponding to an arrangement pattern of external electrodes of the semiconductor integrated circuit has been used. The probe unit is equipped with a probe holder provided with a plurality of holes through which the contact probes can pass. The electrodes are in contact with each other to electrically connect the semiconductor integrated circuit and the circuit board (see, for example, Patent Document 1). [0003] Patent Document 1: Japanese Patent Laid-Open No. 2002-107377 [0004] However, in recent years...

AI Technical Summary

Problems solved by technology

However, if the maximum diameter or pitch of the semiconductor electrodes is less than 1 mm, the diameter of the probe must be reduced instead, resulting in a problem that the allowable current becomes smaller

In addition, if two probes are required to inspect one terminal during 4-terminal measurement, the allowable current has to be reduced due to the need for small-diameter probes.

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