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Method for producing a plurality of optoelectronic components

A technology of photoelectric components and electromagnetic rays, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve problems such as cost and trouble

Inactive Publication Date: 2013-06-12
OSRAM OPTO SEMICON GMBH & CO OHG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, individual processing steps, i.e. steps to be carried out individually for each element, are costly and laborious compared to processing steps which can be carried out simultaneously for several elements

Method used

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  • Method for producing a plurality of optoelectronic components
  • Method for producing a plurality of optoelectronic components
  • Method for producing a plurality of optoelectronic components

Examples

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Embodiment Construction

[0040] Refer below Figure 1A The starting point for the method of the invention is described. Figure 1A A semiconductor body carrier 10 is shown, on which a plurality of semiconductor bodies 14 are applied on a first main plane 12 .

[0041] The semiconductor bodies 14 each have a contact structure 20 which is suitable for making electrical contact with the semiconductor bodies 14 . The semiconductor body 14 arranged above the contact structure 20 includes an active layer 16 which is embedded in the semiconductor layer sequence 15 . The active layer 15 is preferably designed to generate radiation. Preferably, the individual semiconductor bodies are embodied as light-emitting diode semiconductor bodies.

[0042]Furthermore, the semiconductor body 14 includes a semiconductor layer sequence 15 . The semiconductor layer sequence 15 can have, for example, two semiconductor layers, between which the active layer 16 is arranged. The semiconductor layers are preferably of diffe...

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PUM

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Abstract

A method for producing a multiplicity of optoelectronic components includes providing a semiconductor body carrier including on a first main area a multiplicity of semiconductor bodies, each provided with a contact structure and having an active layer that generates electromagnetic radiation, in a semiconductor layer sequence, and forming a planar filling structure on the first main area such that the planar filling structure at least partly covers regions of the contact structure and the semiconductor body carrier without covering the semiconductor body.

Description

technical field [0001] The invention relates to a method for producing a plurality of optoelectronic components. Background technique [0002] In order to produce optoelectronic components which are to be fixed on the connection carrier after production and to be contacted, a series of individual process steps are usually required which in particular have to be carried out individually for the production of each component. [0003] However, individual processing steps, ie steps to be carried out individually for each component, are more costly and complex than processing steps which can be carried out simultaneously for a plurality of components. Contents of the invention [0004] The object of the present invention is to provide a method for producing a plurality of optoelectronic components which enables simple production of the optoelectronic components. [0005] This object is solved by a method for producing a plurality of optoelectronic components, which method comp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H05B33/10
CPCH01L2924/0002H01L27/156H01L33/50H01L25/0753H01L2924/00
Inventor S·赫尔曼
Owner OSRAM OPTO SEMICON GMBH & CO OHG