Photographic device
A camera device and objective lens technology, which is applied in the direction of optics, instruments, camera bodies, etc., can solve the problems of increased frictional resistance and high difficulty of the blocking sheet, and achieve the effect of preventing bending
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[0022] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. figure 1 The appearance of the cutting device 2 to which the imaging device of the present invention can be applied and which can cut and divide a semiconductor wafer into individual chips (devices) is shown.
[0023] On the front side of the cutting device 2 is provided an operating member 4 for an operator to input instructions to the device such as machining conditions. A display unit 6 such as a CRT (Cathode Ray Tube: Cathode Ray Tube) is provided on the upper part of the device, and the display unit 6 such as the CRT displays a guidance screen for an operator or an image captured by an imaging unit described later.
[0024] Such as figure 1 As shown, on the surface of the wafer W to be cut, first and second streets S1 and S2 are formed orthogonally, and a large number of devices D are divided by the first and second streets S1 and S2. formed on the wafer ...
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