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Placing mechanism, transport method of wafer having dicing frame

A dicing and framing technology, which is used in the manufacture of conveyor objects, electrical components, semiconductor/solid-state devices, etc., can solve the problem of not mentioning the wafer with a dicing frame, and the method of peeling off a wafer with a dicing frame, etc. question

Active Publication Date: 2012-10-10
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although this method is simple, the method of peeling the wafer with the dicing frame from the mounting surface is not mentioned in this patent document 2.
And, like Patent Document 2, there is no mention of a wafer with a dicing frame in Patent Document 1

Method used

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  • Placing mechanism, transport method of wafer having dicing frame
  • Placing mechanism, transport method of wafer having dicing frame
  • Placing mechanism, transport method of wafer having dicing frame

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Embodiment Construction

[0025] Below, according to figure 1 Embodiments shown in (a) to (c) describe the present invention.

[0026] First, according to figure 1 (a) The mounting mechanism of this embodiment is demonstrated. Such as figure 1 As shown in (a), the mounting mechanism 10 of this embodiment includes: a mounting table 11 on which a wafer DFW with a dicing frame is mounted; a lift drive mechanism (not shown) for lifting the mounting table 11; a plurality of support bodies 12, which can be relatively raised and lowered relative to the mounting table 11 at a predetermined interval along the outer peripheral surface of the mounting table 11, and supports the dicing frame DF from the lower surface; and the first action body 13, which passes through the mounting table 11 When the lifting drive mechanism descends, it acts on a plurality of support bodies 12, lifts up the dicing frame DF, and makes the sheet F of the wafer DFW with the dicing frame leave the mounting table, and is configured...

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Abstract

The invention provides a placing mechanism, a transport method of wafer having a dicing frame and a procedure for transporting the wafer. The transport method is capable of inhibiting the stripping charge between a mounting table and a thin sheet at the initial stage of the mounting table transporting the wafer having a dicing frame. The transport method of the wafer having a dicing frame comprises the following steps that firstly the mounting table (11) declines at a certain first speed by using a lifting drive mechanism, thereby a first function body (13) acts on a plurality of supporting bodies (12), the dicing frame (DF) is lifted at the first speed, and the thin sheet (F) fixed with a wafer (W) is separated from the mounting table to a first position; secondly the mounting table declines at a certain second speed faster than the first speed by using the lifting drive mechanism, thereby the first function body acts on a plurality of supporting bodies, the dicing frame is lifted atthe second speed, and the thin sheet fixed with the wafer is separated from the mounting table to a second position.

Description

technical field [0001] The present invention relates to a mounting mechanism for mounting a wafer with a dicing frame, a method for transferring a wafer with a dicing frame, and a program for transferring a wafer used in the transferring method, and more particularly relates to a method for loading a wafer on a mounting mechanism. A mounting mechanism, a method of transporting a wafer with a dicing frame and A wafer transfer program used in this method. Background technique [0002] As a method of inspecting devices produced in a semiconductor manufacturing process, for example, there is a method in which a wafer on which a plurality of devices has been formed is provided to an inspection apparatus, and the electrical characteristics of each device are directly inspected in the state of the wafer. Such an inspection apparatus includes, for example, a loader chamber that accommodates wafers in units of cassettes and transports wafers for inspection, and a probe chamber that ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/673H01L21/677
CPCH01L21/67132H01L21/67144H01L21/6836H01L21/68742H01L21/7806
Inventor 长坂旨俊小笠原郁男
Owner TOKYO ELECTRON LTD
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