Unlock instant, AI-driven research and patent intelligence for your innovation.

Grinding method

A grinding method and grinding rate technology, applied in the grinding field, can solve the problems of final product thickness variation, no fixed law, and threat of photolithography process

Active Publication Date: 2011-05-11
CSMC TECH FAB2 CO LTD
View PDF3 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen from the figure that the thickness changes between batches are more obvious, and this change does not have a fixed law, it is difficult to adjust the grinding time according to the fixed change trend between each batch
[0004] Therefore, in the prior art, the thickness of the final product due to the unstable grinding rate changes significantly, which will pose a potential threat to the subsequent photolithography process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Grinding method
  • Grinding method
  • Grinding method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The specific implementation of a grinding method provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0017] attached figure 2 Shown is a schematic diagram of the implementation steps of this specific embodiment, including: step S10, the grinding process is evenly distributed into a plurality of continuous time stages; step S11, testing the actual grinding rate V of a grinding device in the first stage r1 ; Step S12, the grinding rate V r1 As the reference grinding rate V in the second stage f2 , the reference grinding rate V f2 for grinding thickness L in the second stage 2 Calculate the implementation time T of grinding 2 ; Step S13, measure and calculate the actual grinding rate V in this stage during the grinding process of the second stage r2 ; Step S14, according to V r1 with V r2 Calculate the reference grinding rate V for the third stage f3 ; Step S15, measure and calculate the actual grind...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a grinding method, which comprises the following steps of: testing an actual grinding rate Vr1 of grinding equipment; and calculating an actual grinding time T2 at a later stage according to the actual grinding rate Vr1. The method has the advantages that: the actual grinding rate is tested in each period of time, and the reference grinding rate at the stage can be adjusted according to the previous actual grinding rate in each period of time; therefore, the aim of obtaining accurate grinding thickness is fulfilled.

Description

【Technical field】 [0001] The invention relates to the field of semiconductor manufacturing, in particular to a grinding method. 【Background technique】 [0002] In the prior art, chemical mechanical polishing usually adopts a fixed-time polishing method, and the medium layer to be polished is ground from a certain film thickness (such as 1000 nm) to another film thickness (such as 600 nm). However, the grinding rate of grinding equipment is usually unstable, and there will be a certain deviation every time. In the case of a fixed time, we will find that the actual thickness of the product fluctuates up and down during this time period, and cannot be stabilized within a relatively fixed range. [0003] attached figure 1 Shown are the thickness values ​​of different batches of products obtained by online monitoring on the production line. The abscissa represents the time, and the ordinate represents the grinding thickness of the surface film of each batch. The cumulative grin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B24B37/04H01L21/302B24B37/013
Inventor 李健胡骏杜建
Owner CSMC TECH FAB2 CO LTD