Unlock instant, AI-driven research and patent intelligence for your innovation.

Manufacture method for wiring board and stitch arrangement device

A technology of wiring substrate and manufacturing method, which is applied in the manufacture of semiconductor/solid-state device, the formation of electrical connection of printed elements, and the electrical connection of printed elements, etc., can solve the problem that the manufacturing efficiency of wiring substrates such as PGAs and other pin erection cannot be sufficiently improved, and the long period of time, etc. problem, to achieve the effect of improving pin insertion efficiency and improving manufacturing efficiency

Inactive Publication Date: 2013-10-16
NGK SPARK PLUG CO LTD
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method also has the problem that it takes a long time to insert the front end of the stitch into all the through holes of the stitch erecting tool.
[0007] As a result, in the above-mentioned prior art, it is not possible to sufficiently improve the manufacturing efficiency of wiring boards with upright pins such as PGAs.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacture method for wiring board and stitch arrangement device
  • Manufacture method for wiring board and stitch arrangement device
  • Manufacture method for wiring board and stitch arrangement device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0042] Figure 1 to Figure 7 It is a process diagram which shows the manufacturing method of the wiring board in 1st Embodiment. in addition, Figure 1 to Figure 7 A cross section in the longitudinal direction of the assembly in each step is shown.

[0043] First, if figure 1 As shown, the substrate 11 is prepared for pin insertion. The stitch insertion substrate 11 has a structure in which a plurality of stitch insertion holes 11C are formed penetratingly from the main surface 11A side toward the rear surface 11B side in the thickness direction. In addition, the stitch insertion opening on the main surface 11A side of the stitch insertion hole 11C is chamfered to form an inclined surface 11D that expands outward. In addition, the chamfering of the pin insertion hole facilitates the insertion of a plurality of pins to be inserted later into the pin insertion hole 11C.

[0044] In addition, the stitch 15 is composed of a front end portion 151 and a base end portion 152 , a...

no. 2 Embodiment approach

[0064] Figure 9 ~ Figure 11 It is a process drawing which shows the manufacturing method of the wiring board of 2nd Embodiment. also, Figure 9 ~ Figure 11 A cross section in the longitudinal direction of the assembly in each step is shown.

[0065] In addition, in this embodiment, only the manufacturing method of the pin wiring board is different, and other steps are the same as those of the first embodiment, so in this embodiment, the description will focus on the manufacturing method of the pin wiring board. In addition, the same reference numerals are used for similar or identical components.

[0066] First, as in the first embodiment, a pin insertion substrate 11 is prepared. Next, if Figure 9 As shown, on the main surface 11A of the pin insertion substrate 11 , the mask member 13 having the opening 13A is arranged such that the opening 13A coincides with the pin insertion hole 11C. In addition, on the main surface 11A of the pin insertion substrate 11, a pair of h...

no. 3 Embodiment approach

[0085] Figure 12 to Figure 14 It is a process drawing which shows the manufacturing method of the wiring board of 3rd Embodiment. also, Figure 12 to Figure 14 A cross section in the longitudinal direction of the assembly in each step is shown.

[0086] In addition, in this embodiment, the method of connecting the pin array substrate and the wiring substrate is different, and the method of manufacturing the pin wiring substrate is the same as that of the first embodiment or the second embodiment. Therefore, in this embodiment, the stitch wiring substrate and the wiring substrate The connection method will be explained mainly. In addition, the same reference numerals are used for similar or identical components.

[0087] According to the first embodiment or the second embodiment, after fabricating the stitch array substrate 19, as Figure 12 As shown, the pin array substrate 19 and the wiring substrate 21 formed with a plurality of connecting portions 21A are opposed to ea...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a manufacture method for a wiring board and a stitch arrangement device, which are capable of manufacturing a wiring board with stitches vertically disposed such as PGA in high efficiency. A plurality of stitch inserting holes are formed thorough in a thickness direction and the stitch inserting holes at a main surface side forms an opening after chamfering, the stitches inserting the board at a preset inclining angle relative to a horizontal direction, and a plurality of stitches are held on the main surface via holding components. Then, an air exhaust operation is performed at a back surface side of the stitches inserting into the board, making the stitches inserting holes become negative pressure, and making the holding components move in a preset direction on the main surface, the plurality of stitches are inserted into the plurality of stitch inserting holes, thereby manufacturing the stitch arrangement device. Then, ends of the plurality of stitches protruding from the plurality of stitch inserting holes of the stitch arrangement board are respectively connected with a plurality of connection parts of the wiring board, the plurality of stitches are transmitted from the plurality of stitch inserting holes of the stitch arrangement board to the connection parts of the wiring board.

Description

technical field [0001] The invention relates to a manufacturing method and a pin arrangement device of a wiring substrate. Background technique [0002] When manufacturing a wiring board such as a PGA (pin grid array), a pin erecting tool is used that fits a pin into a pin connection portion of the wiring board to connect it. This stitch erecting jig has a structure in which a plurality of through-holes are formed in a plate-shaped member, and stitches are inserted into these through-holes. The stitch is composed of a front end and a base end, the front end of the stitch is inserted into the through hole, and the base end is exposed outward. [0003] Then, align the pin erecting tool with the wiring board, insert and connect the base end protruding from the pin erecting tool to the connecting portion of the wiring board, thereby manufacturing a wiring board such as a PGA with the pin erecting. In addition, the tips of the pins inserted into the wiring board protrude outwar...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L21/00H05K1/11H05K3/40
Inventor 今西明广
Owner NGK SPARK PLUG CO LTD