Stirring device of electroplating bath

Abstract

The invention discloses a stirring device of an electroplating bath. The stirring device comprises a ledge (1), a base (2), a separation board (3) and a cross beam (4), wherein the separation board (3) is transversely fixed on the base (2); the cross beam (4) is longitudinally fixed on the ledge (1); and a pneumatic device is arranged on the ledge (1) and comprises a plurality of transverse air tubes. According to the stirring device of the electroplating bath, which is disclosed by the invention, the precipitated impurity in electroplating liquid can be prevented from being stirred.

Description

technical field [0001] The invention relates to the field of stirring devices, in particular to a stirring device for an electroplating tank. Background technique [0002] At present, the electroplating process of Dumet wire is mainly through the electrolysis process. After the voltage is input between the anode and the cathode, the metal ions in the electrolyte are attracted to swim to the cathode, and after reduction, they are plated on the plated object connected to the cathode. At the same time The metal connected to the anode is re-dissolved to provide more metal ions in the electrolyte, so that the electrolysis process continues until sufficient coating is deposited on the object to be plated. [0003] Common electroplating conditions are nothing more than current density, stirring, current waveform, electroplating position, etc. Among them, improving the stirring conditions can quickly remove the hydrogen bubble reaction on the surface of the cathode, thereby improvin...

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Problems solved by technology

[0003] Common electroplating conditions are nothing more than current density, stirring, current waveform, electroplating position, etc. Among them, improving the stirring conditions can quickly remove the hydrogen bubble reaction on the surface of the cathode, thereby improving the electroplating efficiency, improving the film thickness distribution, and eliminating burning phenomena, etc. Advantages, however, most of the impurities in the electroplating tank are deposited at the bottom of the electroplating tank, which is very easy to be carried up by the air bubbles discharged from the air pipe, and adhere to the surface of the plated object, thereby affecting the electroplating quality of the plated object

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