Dispensing apparatus for chip welding machine
A glue dispensing device and chip welding technology, which is applied to the surface coating liquid device, coating, semiconductor devices, etc., can solve the problems of difficult management and quantity adjustment, and achieve the effect of easy adjustment
Active Publication Date: 2012-05-30
PROTEC CO LTD
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- Application Information
AI Technical Summary
Problems solved by technology
However, errors of a few μm to tens of μm are likely to occur during the use of the device, for example, after cleaning the viscose storage container and reinstalling it for use, the management of this error range is very difficult
[0005] In addition, it is necessary to be able to adjust the amount of adhesive according to the size of the attached semiconductor chip, but the problem is that it is extremely difficult to adjust the amount due to the characteristics of liquid adhesive
Method used
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Embodiment Construction
[0016] An embodiment of a dispensing device for a chip bonding machine of the present invention will be described below with reference to the accompanying drawings.
[0017] figure 1 It is a cross-sectional view of a dispensing device for a chip bonding machine according to an embodiment of the present invention, figure 2 yes figure 1 The Ⅱ-Ⅱ line sectional view of the dispensing device for the chip bonding machine shown, image 3 yes figure 1 An exploded oblique view of the main parts of the dispensing device for the die bonder shown.
[0018] refer to Figure 1 to Figure 3 , the dispensing device for a die bonding machine in this embodiment includes a base 101 , a container member 200 , a rotating module 300 and an extruding member 400 .
[0019] The main structure of the die bonding machine including the dispensing device for the die bonding machine is installed on the base 101 , and the function of the base 101 is to support the main structure relative to the ground....
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Provided is a dispensing apparatus for a chip welding machine, used for dispensing liquid glue upon the position where a semiconductor chip is to be attached, thus to make the semiconductor chip to be attached to a mainboard or a lead frame. The dispensing apparatus comprises a pedestal, a container member, a rotating module, an extruding member, a support member, and a dispensing module, wherein the container member comprises an outside member and an inside member. The outside member, with a cylindrical shape, is provided with a female thread part at the internal side surface while the inside member is provided with a male thread part at the external side surface to combine with the female thread part of the outside member in a screw manner. Moreover, a dipping surface is provided for the glue to be coated thereon. The extruding member is provided with an extruding part arranged opposite to the dipping surface. Therefore, when the container member rotates, the glue upon the dipping surface is coated. The dispensing apparatus for a chip welding machine of the utility model is easy to keep and adjust the set dispensing amount.
Description
technical field [0001] The present invention relates to a glue dispensing device for a chip bonding machine, and in more detail, relates to a glue dispensing device for a welding machine that applies liquid glue to a position where a semiconductor chip is to be attached so as to attach the semiconductor chip to a main board or a lead frame . Background technique [0002] Die bonding machines that attach semiconductor chips to lead frames or motherboards typically dip liquid adhesive onto a dispensing needle, and then apply the dispensing needle to the lead frame. Use a dispensing needle to apply a small amount of glue on the lead frame, and then place the semiconductor chip on it to attach the semiconductor chip to the lead frame. [0003] As technology develops, the size of semiconductor chips attached by die bonding machines like this tends to be smaller and smaller. Therefore, it is extremely important to apply a very small amount of adhesive to the lead frame at a cert...
Claims
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IPC IPC(8): B05C5/02B05C11/10B05C11/11H01L21/00H01L21/58
CPCH01L21/67144H01L24/75H01L2224/7555
Inventor 高允成
Owner PROTEC CO LTD