Dispensing apparatus for chip welding machine
A glue dispensing device and chip welding technology, which is applied to the surface coating liquid device, coating, semiconductor devices, etc., can solve the problems of difficult management and quantity adjustment, and achieve the effect of easy adjustment
Active Publication Date: 2014-09-03
PROTEC CO LTD
View PDF7 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, errors of a few μm to tens of μm are likely to occur during the use of the device, for example, after cleaning the viscose storage container and reinstalling it for use, the management of this error range is very difficult
[0005] In addition, it is necessary to be able to adjust the amount of adhesive according to the size of the attached semiconductor chip, but the problem is that it is extremely difficult to adjust the amount due to the characteristics of liquid adhesive
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0016] figure 1 It is a cross-sectional view of a dispensing device for a chip bonding machine according to an embodiment of the present invention, figure 2 yes figure 1 The Ⅱ-Ⅱ line sectional view of the dispensing device for the chip bonding machine shown, image 3 yes figure 1 An exploded oblique view of the main parts of the dispensing device for the die bonder shown.
[0017] refer to Figure 1 to Figure 3 , the dispensing device for a die bonding machine in this embodiment includes a base 101 , a container member 200 , a rotating module 300 and an extruding member 400 .
[0018] The main structure of the die bonding machine including the dispensing device for the die bonding machine is installed on the base 101 , and the function of the base 101 is to support the main structure relative to the ground.
[0019] The rotating module 300 is installed on the base 101 and has a turntable 320 and a rotating means. The rotating means is combined with the turntable 320, an...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
Disclosed is a dispensing device for a chip welding machine, aiming at dispensing liquid glue on the position where the semiconductor chip is to be attached, so that the semiconductor chip can be attached to the main board or the lead frame. A glue dispensing device for a chip welding machine includes: a base, a container component, a rotating module, an extruding component, a supporting component and a glue dispensing module. The container member has an outer member and an inner member, the outer member has a cylindrical shape, and a female thread portion is formed on the inner surface, and the inner member has a male thread portion on the outer surface that can be screwed with the female thread portion of the outer member. , and has an impregnated surface for adhesive coating on it. The pressing member has a pressing portion placed opposite to the dipping surface so that when the container member is rotated, the glue on the dipping face is wiped. The device of the invention is easy to maintain the predetermined glue dispensing amount and adjust the glue dispensing amount easily.
Description
technical field [0001] The present invention relates to a glue dispensing device for a chip bonding machine, and in more detail, relates to a glue dispensing device for a welding machine that applies liquid glue to a position where a semiconductor chip is to be attached so as to attach the semiconductor chip to a main board or a lead frame . Background technique [0002] Die bonding machines that attach semiconductor chips to lead frames or motherboards typically dip liquid adhesive onto a dispensing needle, and then apply the dispensing needle to the lead frame. Use a dispensing needle to apply a small amount of glue on the lead frame, and then place the semiconductor chip on it to attach the semiconductor chip to the lead frame. [0003] As technology develops, the size of semiconductor chips attached by die bonding machines like this tends to be smaller and smaller. Therefore, it is extremely important to apply a very small amount of adhesive to the lead frame at a cert...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): B05C5/02B05C11/10B05C11/11H01L21/00H01L21/58
CPCH01L21/67144H01L24/75H01L2224/7555
Inventor 高允成
Owner PROTEC CO LTD