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Lighting devices including thermally conductive housings and related structures

A technology for lighting devices and housings, which is applied to lighting devices, loss prevention measures for lighting devices, cooling/heating devices for lighting devices, etc., can solve problems such as the influence of performance and life of solid-state lighting devices, and the inability to easily accommodate cooling structures.

Inactive Publication Date: 2012-07-11
CREE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, existing buildings often have Edison sockets in the enclosure to receive conventional light bulbs, whereas solid state lighting fixtures may require DC power.
Furthermore, if proper cooling is not provided, the performance and lifespan of solid-state lighting fixtures can be negatively affected, and the space provided by conventional lamp sockets (such as lighting pots) for conventional light bulbs may not readily accommodate the space normally provided for solid-state lighting fixtures. cooling structure

Method used

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  • Lighting devices including thermally conductive housings and related structures
  • Lighting devices including thermally conductive housings and related structures
  • Lighting devices including thermally conductive housings and related structures

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Embodiment Construction

[0025] The present invention will now be described more fully with reference to the accompanying drawings, in which various embodiments are shown. However, this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. Like reference numerals refer to like elements throughout.

[0026] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It should also be understood that when used in this specification, the terms...

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Abstract

A lighting device may include a light emitting device and a sidewall extending away from the light emitting device. In addition, a thermally conductive housing may be spaced apart from the sidewall, and a cavity may be defined between the sidewall and the thermally conductive housing. In addition, a lens may be spaced apart from the light emitting device with the sidewall extending away from the light emitting device to the lens to define a mixing chamber adjacent the light emitting device. Moreover, the thermally conductive housing may be outside the mixing chamber, and the sidewall may be reflective.

Description

[0001] related application [0002] This application is a continuation-in-part (CIP) of U.S. Patent Application No. 12 / 621,970, filed November 19, 2009, which is a continuation-in-part of U.S. Patent Application No. 12 / 566,857, filed September 25, 2009 (CIP). This application is also a continuation-in-part (CIP) of US Application No. 12 / 566,861, filed September 25, 2009, and US Application No. 29 / 344,218, filed September 25, 2009. The entire disclosures of all of the aforementioned applications are hereby incorporated by reference. Background technique [0003] There are ongoing efforts to develop more energy-efficient systems. Since the majority of electricity produced in the United States (some estimates as high as twenty-five percent) is used for lighting, there are ongoing efforts to provide more energy-efficient lighting. Solid state lighting devices (eg, light emitting diodes) are of interest because light can be generated more efficiently using solid state lighting d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00
CPCF21V15/011F21K9/137F21Y2101/02F21V29/507F21K9/233F21Y2115/10F21V29/00
Inventor A.P.范德文陈惠坤何展华
Owner CREE INC