Check patentability & draft patents in minutes with Patsnap Eureka AI!

Light emitting diode package

一种发光二极管、封装件的技术，应用在电气元件、电固体器件、半导体器件等方向，能够解决孔杯尺寸限制、难发光二极管等问题

Active Publication Date: 2012-09-05
SEOUL SEMICONDUCTOR
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to apply this technology to conventional LED packages as described above due to the size limitation on the hole cup caused by the insufficient wire bonding area of ​​the lead frame.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light emitting diode package
  • Light emitting diode package
  • Light emitting diode package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] Hereinafter, the present invention will be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the present invention are shown. However, the present invention can be implemented in many different forms and should not be construed as being limited to the exemplary embodiments presented here. On the contrary, these exemplary embodiments are provided to make this disclosure thorough, and these exemplary embodiments will fully convey the scope of the present invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. In the drawings, the same reference numerals represent the same elements.

[0029] figure 2 Is a plan view of a light emitting diode package according to an exemplary embodiment of the present invention, image 3 Is along figure 2 A cross-sectional view taken at line I-I.

[0030] Such as figure 2 with image 3 As shown, the light emitti...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A light emitting diode package includes a first lead frame comprising a first hole cup, a second lead frame comprising a second hole cup and disposed to face the first lead frame with a gap disposed between the first lead frame and the second lead frame, a first light emitting diode chip disposed on the first hole cup, and a second light emitting diode chip disposed on the second hole cup, the first lead frame comprising a first enlarged region formed between the gap and the first hole cup, and the second lead frame comprising a second enlarged region formed between the gap and the second hole cup.

Description

[0001] This application claims the priority and rights of Korean Patent Application No. 10-2011-0018519 filed on March 2, 2011, and for all purposes as fully described herein, the application is incorporated herein by reference. Technical field [0002] The present invention relates to a light emitting diode package, and more specifically, to a light emitting diode package with excellent reliability. Background technique [0003] Generally, the light emitting diode package includes a light emitting diode chip and a lead frame for applying power to the light emitting diode chip. The lead frame is supported by the package body and is electrically connected to the light emitting diode chip through bonding wires. The package body is used not only to support the lead frame, but also to protect the light emitting diode chip contained therein. [0004] The light emitting diode package generally has a structure in which a pair of light emitting diode chips are mounted on a pair of facing l...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/62H01L25/16
CPCH01L25/0753H01L25/167H01L33/486H01L2224/48091H01L2224/48247H01L2224/48257H01L2224/49109H01L33/62H01L2924/00014H01L2924/00
Inventor 姜都滢金墺石
Owner SEOUL SEMICONDUCTOR
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com