Self-adaptive noise suppression driver circuit

A technology for noise suppression and driving circuits, applied in electrical components, electronic switches, pulse technology, etc., can solve the problems of limited driving capacity, limited application range, large distortion of output signals, etc., and achieve the effect of reducing distortion

Active Publication Date: 2012-10-17
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its driving capability is still limited. When the load is heavy, it will also cause a large distortion of the output signal, thus limiting its application range.

Method used

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  • Self-adaptive noise suppression driver circuit
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  • Self-adaptive noise suppression driver circuit

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Embodiment 1

[0030] Embodiment one: see attached Image 6 shown.

[0031] An adaptive noise suppression drive circuit comprising

[0032] A driving module, the driving module adopts an existing driving circuit;

[0033] A deceleration module, the output terminal of the deceleration module is connected to the drive module, and the deceleration module increases the rise time tr and the fall time tf of the output signal of the drive module;

[0034] The above drive module and deceleration module are the same as the existing drive circuit with synchronous switching noise suppression function, on this basis, the adaptive noise suppression drive circuit also includes

[0035] A sensing module, the input end of the sensing module is connected to the output end of the driving module, and the sensing module senses the change of the rising time and falling time of the output signal of the driving module and outputs the sensing signal;

[0036] Acceleration module, the input terminal of the accele...

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PUM

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Abstract

The invention relates to a self-adaptive noise suppression driver circuit which comprises a driver module, a speed down module, an induction module and a speed up module, wherein the output end of the speed down module is connected with the driver module, and the speed down module is used for increasing the rise time and the fall time of an output signal of the driver module; the input end of the induction module is connected with the output end of the driver module, and the induction module inducts the change of the rise time and the fall time of the output signal of the driver module and outputs an induction signal; and the input end of the speed up module is connected with the output end of the induction module, the output end of the speed up module is connected to the driver module in a feedback manner, and the speed up module automatically reduces the rise time and the fall time of the output signal of the driver module according to the induction signal, and increases the driving capability of the driver module. The driver circuit provided by the invention has self-adaptive capability and automatically adjusts the rise time and the fall time of the output signal according to the different external load capacitors, and further, the synchronous switching noise of the output signal is reduced and the driving capability is increased, and the distortion of signals is reduced.

Description

technical field [0001] The invention relates to an adaptive noise suppression drive circuit. Background technique [0002] Simultaneous switching noise (Simultaneous Switch Noise, SSN) has become a very important problem in modern integrated circuit design. When multiple devices are in the switching state at the same time, an instantaneously changing current (di / dt) is generated, and when passing through the inductance on the return path, an AC voltage drop is formed, and the noise caused by this is sometimes called synchronous switching output noise (Simultaneous Switch Output Noise, SSON). If the ground plane fluctuates due to the package inductance, causing the chip ground and the system ground to be inconsistent, we call this phenomenon ground bounce (Ground Bounce); if the power supply difference between the chip and the system is caused by package inductance, it is called Power Bounce. [0003] attached figure 1 is the equivalent model of the chip package pins, whe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03K17/16
Inventor 唐兴刚胡传菊龙善丽王丽贺克军陈超
Owner EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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