Formula and preparation process of heat-conducting aluminum base copper-clad plate with high heat resistance and high insulation

Abstract

The present invention relates to a formula and a preparation process of a heat-conducting aluminum base copper-clad plate with high heat resistance and high insulation, and belongs to the technical field of chemical product manufacturing. The copper-clad plate comprises raw materials of TDE-85 epoxy resin, E-51 epoxy resin, hydroxyl-terminated polybutadiene liquid rubber, benzyl dimethylamine, dual nitrile amine, KH-560 silane coupling agent, nitride boron powder, alumina powder, aluminum nitride powder and silicon nitride powder. The preparation process comprises steps of mixing, stirring, heating, coating, drying and laminating. A product can be a copper foil layer, an aluminum substrate., and an intermediate high insulating heat-conducting adhesive coating. The product produced by the invention has a high long-term heat resistance and can be used at a high temperature of 150 DEG C for a long time. The product has excellent electric insulation, small dielectric constant and dielectric loss, and high breakdown voltage, and is suitable for occasions requiring high insulation. The heat-conducting adhesive coating has the advantages of simple preparation process, convenient coating construction and cost saving.

Description

1. Technical field [0001] The invention relates to a composition and a manufacturing method of a high-heat-resistant, high-insulation and heat-conducting aluminum-based copper-clad laminate, in particular to a composition and a preparation process of a high-heat-resistant, high-insulation and heat-conducting aluminum-based copper-clad laminate, which belongs to the manufacturing technology of chemical products In the field, its products can be copper foil layers, aluminum substrates, and high-insulation and thermal-conductive adhesive layers in the middle. 2. Background technology [0002] At present, the heat-conducting aluminum-based copper-clad laminates in the market, such as those produced by Taiwan Clear Technology and Zhuhai Quanbao Electronics, are mainly formulated with epoxy resin, plasticizer or nitrile rubber or thermoplastic engineering plastics as tougheners, and bis-nitrile Amine is used as a curing agent, combined with inorganic heat-conducting powders such a...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem of low heat resistance, poor insulation and complex processing technology of aluminum-based copper-clad laminates in the prior art, thereby providing a new technical solution

Images