Semiconductor component and method of manufacturing a semiconductor component
A technology of semiconductors and components, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as easy cracking, severe bending, and easy damage to wafers
Active Publication Date: 2012-11-21
INFINEON TECH AG
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[0020] The following detailed description refers to the accompanying drawings that show, by way of illustration, specific details and embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. Other embodiments may be utilized and structural, logical, and electrical changes may be made without departing from the scope of the present invention. The various embodiments are not necessarily mutually exclusive, as some embodiments can be combined with one or more other embodiments to form new embodiments. Accordingly, the following detailed description is not to be taken in a limiting sense, and the scope of the invention is defined by the appended claims.
[0021] Various embodiments are provided for apparatuses and various embodiments are provided for methods. It should be understood that the basic properties of the device also apply to the method and vice versa. Accord...
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In various embodiments, a semiconductor component may include a semiconductor layer having a front side and a back side; at least one electronic element formed at least partially in the semiconductor layer; at least one via formed in the semiconductor layer and leading from the front side to the back side of the semiconductor layer; a front side metallization layer disposed over the front side of the semiconductor layer and electrically connecting the at least one electronic element to the at least one via; a cap disposed over the front side of the semiconductor layer and mechanically coupled to the semiconductor layer, the cap being configured as a front side carrier of the semiconductor component; a back side metallization layer disposed over the back side of the semiconductor layer and electrically connected to the at least one via.
Description
technical field [0001] The various embodiments generally relate to a semiconductor component (semiconductor component) and a method of manufacturing the semiconductor component. Background technique [0002] Today, semiconductor components, or chips, are typically manufactured from thin slices (slices) of semiconductor material, called wafers. Thin chips not only pose great challenges in the front-end (front-end) manufacturing process, but as the thickness is reduced, the wafer becomes very fragile, prone to cracking, and severely warped due to its low rigidity. Accordingly, apparatus and processes (methods) that facilitate safe handling of thin semiconductor components or chips are desired. Contents of the invention [0003] In one aspect, the present invention provides a semiconductor component comprising: a semiconductor layer having a front side and a back side; at least one electronic component at least partially formed in said semiconductor layer; at least one via f...
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IPC IPC(8): H01L23/00H01L21/50
CPCH01L2224/06102H01L2224/05155H01L2224/05025H01L23/544H01L2224/05124H01L2224/05644H01L2224/32225H01L2224/73253H01L21/78H01L23/53276H01L2224/02379H01L2224/48091H01L24/05H01L23/525H01L2224/1403H01L2224/05184H01L2224/05611H01L23/481H01L2224/02372H01L2223/54486H01L2224/94H01L24/13H01L23/53266H01L2224/05639H01L2224/05166H01L2224/05023H01L29/78H01L23/53238H01L2224/05147H01L2924/13091H01L2924/01322H01L2221/68327H01L2224/131H01L2223/54433H01L2224/05655H01L2224/0401H01L2924/01029H01L23/53223H01L21/6836H01L2924/3025H01L2224/04042H01L2924/12042H01L2924/1305H01L2924/1306H01L2924/00014H01L2224/11H01L2224/03H01L2924/014H01L2924/00
Inventor 奥利弗·黑贝伦杰拉尔德·拉克纳安东·毛德
Owner INFINEON TECH AG